Optimisation of low dissipation micro-hotplates - Thermo-mechanical design and characterisation

Ferenc Biro, Csaba Ducso, Zoltan Hajnal, Andrea Edit Pap, Istvan Barsony

Research output: Contribution to conferencePaper

3 Citations (Scopus)

Abstract

This work describes the results of a systematic investigation of micro-hotplates on thin isolating membranes capable of operation up to 600 °C both in static and dynamic mode. For the selection of optimum device geometry and the layer structure alternatives FEM analysis was applied. The materials considered were Si3N4, SiO2, TiO 2/Pt, Al2O3 and their combination in various multilayer structures. To reduce the chip size DRIE was selected for the release of the membrane. Experimental characterization of the hotplates was carried out by various techniques; the average hotplate temperature was deduced from the resistance of the applied Pt heater and verified by micro-melting point measurements. Buckling of the membranes was tested by means of optical methods and the cumulative stress of the multilayer structure quantified by Makyoh-topography. Pulsed mode cyclic heating revealed the dynamic properties and also served for accelerated stability tests. For demonstration microheater devices with heat dissipation up to 23 °C/mW and t90 < 3ms were constructed to form the basis of combustive type gas sensors operated at elevated temperature.

Original languageEnglish
Pages116-121
Number of pages6
DOIs
Publication statusPublished - Jan 1 2013
Event19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013 - Berlin, Germany
Duration: Sep 25 2013Sep 27 2013

Other

Other19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013
CountryGermany
CityBerlin
Period9/25/139/27/13

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ASJC Scopus subject areas

  • Hardware and Architecture

Cite this

Biro, F., Ducso, C., Hajnal, Z., Pap, A. E., & Barsony, I. (2013). Optimisation of low dissipation micro-hotplates - Thermo-mechanical design and characterisation. 116-121. Paper presented at 19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013, Berlin, Germany. https://doi.org/10.1109/THERMINIC.2013.6675223