On the fabrication parameters of buried microchannels integrated in in-plane silicon microprobes

Z. Fekete, A. Pongrácz, G. Márton, P. Fürjes

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

This paper aims the characterization of buried microchannels in silicon realized by deep reactive ion etching. The effects of dry etching parameters on the integrability into hollow microprobes are thoroughly investigated from both technological and functional aspects. Results are supposed to give physiology related probe designers a deeper insight into microfabrication-related issues.

Original languageEnglish
Title of host publicationMaterials Science, Testing and Informatics VI
PublisherTrans Tech Publications Ltd
Pages210-215
Number of pages6
ISBN (Print)9783037854914
DOIs
Publication statusPublished - 2013
Event8th Hungarian Conference on Materials Science - Balatonkenese, Hungary
Duration: Oct 9 2011Oct 11 2011

Publication series

NameMaterials Science Forum
Volume729
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Other

Other8th Hungarian Conference on Materials Science
CountryHungary
CityBalatonkenese
Period10/9/1110/11/11

Keywords

  • Buried microchannel
  • Deep reactive ion etching
  • Hollow microprobes
  • Microfluidics

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Fekete, Z., Pongrácz, A., Márton, G., & Fürjes, P. (2013). On the fabrication parameters of buried microchannels integrated in in-plane silicon microprobes. In Materials Science, Testing and Informatics VI (pp. 210-215). (Materials Science Forum; Vol. 729). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.729.210