On the effects of mechanical and thermal treatment strategies regarding the grain boundary structure of polycrystalline copper

P. Varga, P. J. Szabó

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Commercial Cu-ETP drawn copper bar was both mechanically and thermally treated. Repeated cycles of cold rolling and heat treatment with altered parameters were applied on the specimens. Grain boundary character distribution (GBCD) was calculated from the orientation microscopy data. As regards the processing of the orientation data the coincidence site lattice theory was applied. The evolution of the GBCD is discussed in terms of the parameters of cold rolling and heat treatment processes.

Original languageEnglish
Title of host publicationMaterials Science, Testing and Informatics VI
Pages503-508
Number of pages6
DOIs
Publication statusPublished - Jan 1 2013
Event8th Hungarian Conference on Materials Science - Balatonkenese, Hungary
Duration: Oct 9 2011Oct 11 2011

Publication series

NameMaterials Science Forum
Volume729
ISSN (Print)0255-5476

Other

Other8th Hungarian Conference on Materials Science
CountryHungary
CityBalatonkenese
Period10/9/1110/11/11

Keywords

  • CSL grain boundaries
  • Cold rolling
  • Copper
  • EBSD
  • GBCD
  • Recrystallization

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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