Nowadays in IC manufacturing besides accurate electrical design, there is a pronounced need for layout design optimized for the thermal properties of the chip as well. The recent developments of the PC-based THERMANAL heat distribution simulation program and the latest version of the TRANS-TRAN circuit analysis program together try to satisfy this need. These programs are fully functional as stand alone products but they can be used together as well. The latter means that the power dissipation of the individual circuit elements obtained from a TRANS-TRAN simulation can be directly used in the heat-distribution calculations. Besides well-established algorithms and models both programs provide many new features, such as implementations of new theoretical results in heat-conduction calculations or novel software solutions for device modelling. The user-interfaces of the programs have the same look and feel and provide as many graphics as possible which is a great merit in educational applications.
|Number of pages||19|
|Publication status||Published - Dec 1 1990|
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