New way for thermal transient testing

Research output: Chapter in Book/Report/Conference proceedingChapter

21 Citations (Scopus)

Abstract

This paper introduces a new concept of thermal transient measurement of IC packages, without a tester. The thermal transient test kit described here consists of a test chip, a dedicated software running on a PC and a special cable connecting the PC to the IC package which encapsulates the test chip. The functionality of a thermal transient test equipment is realized by the test chip itself and the measuring software. The software performs both the control of the measurement and the evaluation of the results. The final output of the evaluation software is a compact model network and the structure function, describing the properties of the heat conduction path realized by the IC package under test. The use of the test kit and the capabilities of its evaluation software are demonstrated by a few examples.

Original languageEnglish
Title of host publicationAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
PublisherIEEE
Pages182-188
Number of pages7
Publication statusPublished - 1999
EventProceedings of the 1999 15th Annual IEEE Semiconductor Thermal Measurement and Management Symposium - San Diego, CA, USA
Duration: Mar 9 1999Mar 11 1999

Other

OtherProceedings of the 1999 15th Annual IEEE Semiconductor Thermal Measurement and Management Symposium
CitySan Diego, CA, USA
Period3/9/993/11/99

Fingerprint

computer programs
Testing
Describing functions
kits
chips
test equipment
Heat conduction
evaluation
Cables
conductive heat transfer
cables
Hot Temperature
output

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Instrumentation

Cite this

Székely, V., Rencz, M., Poppe, A., & Courtois, B. (1999). New way for thermal transient testing. In Annual IEEE Semiconductor Thermal Measurement and Management Symposium (pp. 182-188). IEEE.

New way for thermal transient testing. / Székely, V.; Rencz, M.; Poppe, A.; Courtois, B.

Annual IEEE Semiconductor Thermal Measurement and Management Symposium. IEEE, 1999. p. 182-188.

Research output: Chapter in Book/Report/Conference proceedingChapter

Székely, V, Rencz, M, Poppe, A & Courtois, B 1999, New way for thermal transient testing. in Annual IEEE Semiconductor Thermal Measurement and Management Symposium. IEEE, pp. 182-188, Proceedings of the 1999 15th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, San Diego, CA, USA, 3/9/99.
Székely V, Rencz M, Poppe A, Courtois B. New way for thermal transient testing. In Annual IEEE Semiconductor Thermal Measurement and Management Symposium. IEEE. 1999. p. 182-188
Székely, V. ; Rencz, M. ; Poppe, A. ; Courtois, B. / New way for thermal transient testing. Annual IEEE Semiconductor Thermal Measurement and Management Symposium. IEEE, 1999. pp. 182-188
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