New simulation approaches supporting temperature-aware design of digital ICs

Gergely Nagy, András Timár, Albin Szalai, Márta Rencz, András Poppe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Regarding thermal issues in digital IC design a major concern is how timing integrity is affected by the elevated junction temperature and temperature gradients on the chip surface. To predict this in a thermal aware design process one needs a dedicated simulation tool in which the logic simulation of the circuit is coupled to the thermal simulation of the chip and its environment. This paper presents two approaches to this so called logi-thermal simulation. In one of our approaches we rely completely on industry standard EDA tools, standard EDA file formats and interfaces. In the other solution which provides us total freedom in the abstraction level of circuit description and simulation accuracy we use our own logic simulation engine. In both cases the logic simulation engine is connected to our own thermal simulation engines which also use compact thermal models of the IC package during simulation. This paper describes certain implementation aspects and features of our logi-thermal simulation solutions, with emphasizes on modeling the thermal properties of the IC packaging.

Original languageEnglish
Title of host publication28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2012
Pages313-318
Number of pages6
DOIs
Publication statusPublished - May 22 2012
Event28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2012 - San Jose, CA, United States
Duration: Mar 18 2012Mar 22 2012

Publication series

NameAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
ISSN (Print)1065-2221

Other

Other28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2012
CountryUnited States
CitySan Jose, CA
Period3/18/123/22/12

Keywords

  • Logi-thermal simulation
  • thermal effect of chip packaging
  • timing integrity

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering

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  • Cite this

    Nagy, G., Timár, A., Szalai, A., Rencz, M., & Poppe, A. (2012). New simulation approaches supporting temperature-aware design of digital ICs. In 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2012 (pp. 313-318). [6188866] (Annual IEEE Semiconductor Thermal Measurement and Management Symposium). https://doi.org/10.1109/STHERM.2012.6188866