New possibilities in the thermal evaluation, offered by transient testing

Research output: Contribution to journalArticle

23 Citations (Scopus)

Abstract

After giving an introductory overview of a method for the evaluation the thermal transient measurement results with the help of the structure functions, the use of the method of transient testing is presented by application examples. The first example shows how to control the quality of the die attachment or soldering with fast transient measurements and subsequent evaluation. The second example presents how transient testing can be used to determine thermal material parameters; e.g. the effective thermal conductivity of printed circuit boards.

Original languageEnglish
Pages (from-to)171-177
Number of pages7
JournalMicroelectronics Journal
Volume34
Issue number3
DOIs
Publication statusPublished - Mar 1 2003

Keywords

  • Die attach qualification
  • Partial thermal resistance
  • Structure functions
  • Thermal modeling
  • Thermal testing
  • Thermal transient evaluation
  • Thermal transient testing

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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