New possibilities in the thermal evaluation, offered by transient testing

Research output: Contribution to journalArticle

22 Citations (Scopus)

Abstract

After giving an introductory overview of a method for the evaluation the thermal transient measurement results with the help of the structure functions, the use of the method of transient testing is presented by application examples. The first example shows how to control the quality of the die attachment or soldering with fast transient measurements and subsequent evaluation. The second example presents how transient testing can be used to determine thermal material parameters; e.g. the effective thermal conductivity of printed circuit boards.

Original languageEnglish
Pages (from-to)171-177
Number of pages7
JournalMicroelectronics Journal
Volume34
Issue number3
DOIs
Publication statusPublished - Mar 2003

Fingerprint

soldering
evaluation
printed circuits
Testing
circuit boards
attachment
thermal conductivity
Soldering
Printed circuit boards
Thermal conductivity
Hot Temperature

Keywords

  • Die attach qualification
  • Partial thermal resistance
  • Structure functions
  • Thermal modeling
  • Thermal testing
  • Thermal transient evaluation
  • Thermal transient testing

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

New possibilities in the thermal evaluation, offered by transient testing. / Rencz, M.

In: Microelectronics Journal, Vol. 34, No. 3, 03.2003, p. 171-177.

Research output: Contribution to journalArticle

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