Abstract
The thermal management of semiconductor devices and systems has become a widely discussed topic over the past decades due to the ever increasing integration and the resulting power densities inside the packages. The increasing junction temperature is a great threat for the operation and the long-term reliability of the packaged device. One of the most important barriers in the heat conduction path is the thermal interface material. Their thermal performance significantly influences the overall thermal resistance of a system from the junction to the ambient. In this paper two approaches are described for the accurate thermal conductivity measurement of these materials; both techniques were developed in the framework of the European Nanopack project. One of them is a highly accurate, scientific method which benefits from the improvements of the semiconductor industry: the TIM is measured between two bare sensor chip surfaces. The other method is based on thermal transient testing and allows the measurement of a given grease or paste in its real environment. Both of them are capable of the measurement of highly conductive, nanoparticle based TIM materials. In this paper these two methods are explained in more details and measured results are compared with each-other. The effect of the measurement arrangement on the measured thermal resistance values is also discussed.
| Original language | English |
|---|---|
| Title of host publication | Annual IEEE Semiconductor Thermal Measurement and Management Symposium |
| Pages | 317-324 |
| Number of pages | 8 |
| DOIs | |
| Publication status | Published - 2011 |
| Event | 27th Annual IEEE Semiconductor Thermal Measurement and Management, SEMI-THERM 27 2011 - San Jose, CA, United States Duration: Mar 20 2011 → Mar 24 2011 |
Other
| Other | 27th Annual IEEE Semiconductor Thermal Measurement and Management, SEMI-THERM 27 2011 |
|---|---|
| Country | United States |
| City | San Jose, CA |
| Period | 3/20/11 → 3/24/11 |
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Keywords
- Thermal conductivity
- Thermal interface materials
- Thermal transient testing
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Instrumentation
Cite this
New level of accuracy in TIM measurements. / Vass-Varnai, Andras; Székely, V.; Sarkany, Zoltan; Rencz, M.
Annual IEEE Semiconductor Thermal Measurement and Management Symposium. 2011. p. 317-324 5767218.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - New level of accuracy in TIM measurements
AU - Vass-Varnai, Andras
AU - Székely, V.
AU - Sarkany, Zoltan
AU - Rencz, M.
PY - 2011
Y1 - 2011
N2 - The thermal management of semiconductor devices and systems has become a widely discussed topic over the past decades due to the ever increasing integration and the resulting power densities inside the packages. The increasing junction temperature is a great threat for the operation and the long-term reliability of the packaged device. One of the most important barriers in the heat conduction path is the thermal interface material. Their thermal performance significantly influences the overall thermal resistance of a system from the junction to the ambient. In this paper two approaches are described for the accurate thermal conductivity measurement of these materials; both techniques were developed in the framework of the European Nanopack project. One of them is a highly accurate, scientific method which benefits from the improvements of the semiconductor industry: the TIM is measured between two bare sensor chip surfaces. The other method is based on thermal transient testing and allows the measurement of a given grease or paste in its real environment. Both of them are capable of the measurement of highly conductive, nanoparticle based TIM materials. In this paper these two methods are explained in more details and measured results are compared with each-other. The effect of the measurement arrangement on the measured thermal resistance values is also discussed.
AB - The thermal management of semiconductor devices and systems has become a widely discussed topic over the past decades due to the ever increasing integration and the resulting power densities inside the packages. The increasing junction temperature is a great threat for the operation and the long-term reliability of the packaged device. One of the most important barriers in the heat conduction path is the thermal interface material. Their thermal performance significantly influences the overall thermal resistance of a system from the junction to the ambient. In this paper two approaches are described for the accurate thermal conductivity measurement of these materials; both techniques were developed in the framework of the European Nanopack project. One of them is a highly accurate, scientific method which benefits from the improvements of the semiconductor industry: the TIM is measured between two bare sensor chip surfaces. The other method is based on thermal transient testing and allows the measurement of a given grease or paste in its real environment. Both of them are capable of the measurement of highly conductive, nanoparticle based TIM materials. In this paper these two methods are explained in more details and measured results are compared with each-other. The effect of the measurement arrangement on the measured thermal resistance values is also discussed.
KW - Thermal conductivity
KW - Thermal interface materials
KW - Thermal transient testing
UR - http://www.scopus.com/inward/record.url?scp=79957666198&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=79957666198&partnerID=8YFLogxK
U2 - 10.1109/STHERM.2011.5767218
DO - 10.1109/STHERM.2011.5767218
M3 - Conference contribution
AN - SCOPUS:79957666198
SN - 9781612847344
SP - 317
EP - 324
BT - Annual IEEE Semiconductor Thermal Measurement and Management Symposium
ER -