New level of accuracy in TIM measurements

Andras Vass-Varnai, V. Székely, Zoltan Sarkany, M. Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

The thermal management of semiconductor devices and systems has become a widely discussed topic over the past decades due to the ever increasing integration and the resulting power densities inside the packages. The increasing junction temperature is a great threat for the operation and the long-term reliability of the packaged device. One of the most important barriers in the heat conduction path is the thermal interface material. Their thermal performance significantly influences the overall thermal resistance of a system from the junction to the ambient. In this paper two approaches are described for the accurate thermal conductivity measurement of these materials; both techniques were developed in the framework of the European Nanopack project. One of them is a highly accurate, scientific method which benefits from the improvements of the semiconductor industry: the TIM is measured between two bare sensor chip surfaces. The other method is based on thermal transient testing and allows the measurement of a given grease or paste in its real environment. Both of them are capable of the measurement of highly conductive, nanoparticle based TIM materials. In this paper these two methods are explained in more details and measured results are compared with each-other. The effect of the measurement arrangement on the measured thermal resistance values is also discussed.

Original languageEnglish
Title of host publicationAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
Pages317-324
Number of pages8
DOIs
Publication statusPublished - 2011
Event27th Annual IEEE Semiconductor Thermal Measurement and Management, SEMI-THERM 27 2011 - San Jose, CA, United States
Duration: Mar 20 2011Mar 24 2011

Other

Other27th Annual IEEE Semiconductor Thermal Measurement and Management, SEMI-THERM 27 2011
CountryUnited States
CitySan Jose, CA
Period3/20/113/24/11

Fingerprint

thermal resistance
Heat resistance
greases
Lubricating greases
Semiconductor devices
semiconductor devices
Heat conduction
Temperature control
conductive heat transfer
radiant flux density
Thermal conductivity
thermal conductivity
industries
chips
Semiconductor materials
Nanoparticles
nanoparticles
sensors
Sensors
Testing

Keywords

  • Thermal conductivity
  • Thermal interface materials
  • Thermal transient testing

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Instrumentation

Cite this

Vass-Varnai, A., Székely, V., Sarkany, Z., & Rencz, M. (2011). New level of accuracy in TIM measurements. In Annual IEEE Semiconductor Thermal Measurement and Management Symposium (pp. 317-324). [5767218] https://doi.org/10.1109/STHERM.2011.5767218

New level of accuracy in TIM measurements. / Vass-Varnai, Andras; Székely, V.; Sarkany, Zoltan; Rencz, M.

Annual IEEE Semiconductor Thermal Measurement and Management Symposium. 2011. p. 317-324 5767218.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Vass-Varnai, A, Székely, V, Sarkany, Z & Rencz, M 2011, New level of accuracy in TIM measurements. in Annual IEEE Semiconductor Thermal Measurement and Management Symposium., 5767218, pp. 317-324, 27th Annual IEEE Semiconductor Thermal Measurement and Management, SEMI-THERM 27 2011, San Jose, CA, United States, 3/20/11. https://doi.org/10.1109/STHERM.2011.5767218
Vass-Varnai A, Székely V, Sarkany Z, Rencz M. New level of accuracy in TIM measurements. In Annual IEEE Semiconductor Thermal Measurement and Management Symposium. 2011. p. 317-324. 5767218 https://doi.org/10.1109/STHERM.2011.5767218
Vass-Varnai, Andras ; Székely, V. ; Sarkany, Zoltan ; Rencz, M. / New level of accuracy in TIM measurements. Annual IEEE Semiconductor Thermal Measurement and Management Symposium. 2011. pp. 317-324
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