In the first part of the paper a thermal transient measurement approach is presented that can be applied for the generation of multi-port compact dynamic thermal models of IC packages. Experimental results prove the applicability of the ideas. In the second part of the paper the recent advances in the development of the appropriate measurement tools are described. Among others the authors present a new thermal transient test chip, and T3ster, a new thermal transient tester equipment, developed for high precision one-port or multi-port transient thermal measurements.
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Electrical and Electronic Engineering