Nanolayer barriers for inhibition of copper corrosion

Research output: Contribution to journalArticle

23 Citations (Scopus)

Abstract

Protective nanolayers of alkyl hydroxamic acids deposited on a copper surface as a Langmuir - Blodgettfilm (LB) or as a self assembled molecular layer (SAM) were studied in acidic and neutral sodium chloride and sodium sulphate solutions. The LB film deposition and SAM formation on copper substrate were followed by a surface visualisation technique and by contact angle measurement. Following exposure to aggressive electrolytes the anticorrosion abilities of the monolayers and multilayers were characterised by image analysis, by the roughness of the copper surface, and by an electrochemical method.

Original languageEnglish
Pages (from-to)65-70
Number of pages6
JournalCorrosion Engineering Science and Technology
Volume39
Issue number1
DOIs
Publication statusPublished - Mar 2004

Fingerprint

Copper corrosion
Copper
Hydroxamic Acids
Sodium sulfate
Langmuir Blodgett films
Sodium chloride
Angle measurement
Sodium Chloride
Image analysis
Electrolytes
Contact angle
Monolayers
Multilayers
Visualization
Surface roughness
Acids
Substrates

Keywords

  • Alkyl hydroxamic acid
  • Copper
  • Inhibitor
  • Lagmuir - Blodgett layers
  • Self assembled molecules

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

Nanolayer barriers for inhibition of copper corrosion. / Telegdi, J.; Rigó, T.; Kálmán, E.

In: Corrosion Engineering Science and Technology, Vol. 39, No. 1, 03.2004, p. 65-70.

Research output: Contribution to journalArticle

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