Moulded, plastic PGA packages

Gabor Ripka, Vladimir Szekely

Research output: Contribution to journalArticle

Abstract

The increase of the size of IC chips and the numbers of the pins made it necessary to develop a new kind of package a couple of years ago. PGA packages have appeared and have been used. The authors of this article present a new type of plastic PGA construction. The technology of the package combines the advantages of the production of moulding technologies of packages with PWB. The new plastic PGA package has good electrical and thermal properties and it is cheap. The construction and technology used allow to meet the demands of individual consumers as well - by shortening the time from design to manufacturing. The article describes in detail the testing of the thermal properties of the plastic PGA package.

Original languageEnglish
Pages (from-to)53-72
Number of pages20
JournalPeriodica Polytechnica Electrical Engineering
Volume37
Issue number1
Publication statusPublished - Jan 1 1993

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Moulded, plastic PGA packages'. Together they form a unique fingerprint.

  • Cite this