Molecular Dynamics Model of Nano-metric Peripheral Grinding

Nikolaos E. Karkalos, Angelos P. Markopoulos, J. Kundrák

Research output: Contribution to journalConference article

6 Citations (Scopus)

Abstract

Ultra high precision grinding can render sub-micrometric surface finish of workpieces in an effective way. Accordingly, grinding in the nano-level can be used to produce surface finish of nanometric level or removal of several atomic layers of the substrate. As direct measurements in this scale are either expensive or impossible to be conducted, appropriate simulation models need to be created in order to study the underlying mechanisms of nanometric machining processes. Molecular Dynamics (MD) method is a widely accepted simulation method for this purpose, as it enables direct observation of the process at atomistic level. In this study, an MD simulation of nanometric peripheral grinding with two single crystal diamond grains is conducted with a view to determine cutting forces and temperatures as well as surface integrity and subsurface damage in the workpiece. Using this model, favourable cutting conditions for this process will be able to be determined.

Original languageEnglish
Pages (from-to)281-286
Number of pages6
JournalProcedia CIRP
Volume58
DOIs
Publication statusPublished - Jan 1 2017
Event16th CIRP Conference on Modelling of Machining Operations, CIRP CMMO 2017 - Cluny, France
Duration: Jun 15 2017Jun 16 2017

Fingerprint

Molecular dynamics
Dynamic models
Computer peripheral equipment
Diamonds
Machining
Single crystals
Computer simulation
Substrates
Temperature

Keywords

  • Molecular Dynamics
  • nanometric material removal
  • precision grinding
  • surface integrity

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Industrial and Manufacturing Engineering

Cite this

Molecular Dynamics Model of Nano-metric Peripheral Grinding. / Karkalos, Nikolaos E.; Markopoulos, Angelos P.; Kundrák, J.

In: Procedia CIRP, Vol. 58, 01.01.2017, p. 281-286.

Research output: Contribution to journalConference article

Karkalos, Nikolaos E. ; Markopoulos, Angelos P. ; Kundrák, J. / Molecular Dynamics Model of Nano-metric Peripheral Grinding. In: Procedia CIRP. 2017 ; Vol. 58. pp. 281-286.
@article{33add9f53b494e3ba668da39c80383c5,
title = "Molecular Dynamics Model of Nano-metric Peripheral Grinding",
abstract = "Ultra high precision grinding can render sub-micrometric surface finish of workpieces in an effective way. Accordingly, grinding in the nano-level can be used to produce surface finish of nanometric level or removal of several atomic layers of the substrate. As direct measurements in this scale are either expensive or impossible to be conducted, appropriate simulation models need to be created in order to study the underlying mechanisms of nanometric machining processes. Molecular Dynamics (MD) method is a widely accepted simulation method for this purpose, as it enables direct observation of the process at atomistic level. In this study, an MD simulation of nanometric peripheral grinding with two single crystal diamond grains is conducted with a view to determine cutting forces and temperatures as well as surface integrity and subsurface damage in the workpiece. Using this model, favourable cutting conditions for this process will be able to be determined.",
keywords = "Molecular Dynamics, nanometric material removal, precision grinding, surface integrity",
author = "Karkalos, {Nikolaos E.} and Markopoulos, {Angelos P.} and J. Kundr{\'a}k",
year = "2017",
month = "1",
day = "1",
doi = "10.1016/j.procir.2017.03.189",
language = "English",
volume = "58",
pages = "281--286",
journal = "Procedia CIRP",
issn = "2212-8271",
publisher = "Elsevier BV",

}

TY - JOUR

T1 - Molecular Dynamics Model of Nano-metric Peripheral Grinding

AU - Karkalos, Nikolaos E.

AU - Markopoulos, Angelos P.

AU - Kundrák, J.

PY - 2017/1/1

Y1 - 2017/1/1

N2 - Ultra high precision grinding can render sub-micrometric surface finish of workpieces in an effective way. Accordingly, grinding in the nano-level can be used to produce surface finish of nanometric level or removal of several atomic layers of the substrate. As direct measurements in this scale are either expensive or impossible to be conducted, appropriate simulation models need to be created in order to study the underlying mechanisms of nanometric machining processes. Molecular Dynamics (MD) method is a widely accepted simulation method for this purpose, as it enables direct observation of the process at atomistic level. In this study, an MD simulation of nanometric peripheral grinding with two single crystal diamond grains is conducted with a view to determine cutting forces and temperatures as well as surface integrity and subsurface damage in the workpiece. Using this model, favourable cutting conditions for this process will be able to be determined.

AB - Ultra high precision grinding can render sub-micrometric surface finish of workpieces in an effective way. Accordingly, grinding in the nano-level can be used to produce surface finish of nanometric level or removal of several atomic layers of the substrate. As direct measurements in this scale are either expensive or impossible to be conducted, appropriate simulation models need to be created in order to study the underlying mechanisms of nanometric machining processes. Molecular Dynamics (MD) method is a widely accepted simulation method for this purpose, as it enables direct observation of the process at atomistic level. In this study, an MD simulation of nanometric peripheral grinding with two single crystal diamond grains is conducted with a view to determine cutting forces and temperatures as well as surface integrity and subsurface damage in the workpiece. Using this model, favourable cutting conditions for this process will be able to be determined.

KW - Molecular Dynamics

KW - nanometric material removal

KW - precision grinding

KW - surface integrity

UR - http://www.scopus.com/inward/record.url?scp=85029748990&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85029748990&partnerID=8YFLogxK

U2 - 10.1016/j.procir.2017.03.189

DO - 10.1016/j.procir.2017.03.189

M3 - Conference article

AN - SCOPUS:85029748990

VL - 58

SP - 281

EP - 286

JO - Procedia CIRP

JF - Procedia CIRP

SN - 2212-8271

ER -