Modeling of light emitting device populations in the electrical, thermal and optical domain for luminaire design

Gabor Farkas, Andras Vass-Varnai, Lajos Gaal, Marta Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A modeling methodology to speed up the design of luminaires composed of solid state light emitting devices has been elaborated in the Delphi4LED research project of the European Union. Starting with integrated and automated measurements of packaged LED devices in the electric, thermal and optical domain; the methodology provides SPICE like models, which besides the electrical properties also reflect the thermal and optical ones. The electrical and optical model is based directly on semiconductor physics, for precise modeling of the low-current and high-current decay of efficiency. The compact model of the thermal domain is based on the methodology defined in the previous DELPHI project. Measured data on the population are converted in an optimization process to best fit the model parameter sets. The paper presents the elaborated methodology and also outlines a new JEDEC standard encompassing multiple thermal test environments.

Original languageEnglish
Title of host publicationASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Electronic)9780791859322
DOIs
Publication statusPublished - Jan 1 2019
EventASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019 - Anaheim, United States
Duration: Oct 7 2019Oct 9 2019

Publication series

NameASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019

Conference

ConferenceASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019
CountryUnited States
CityAnaheim
Period10/7/1910/9/19

Keywords

  • Boundary condition
  • Compact models
  • LED physics
  • Multi domain modeling
  • Parameter extraction
  • Thermal transient testing

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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  • Cite this

    Farkas, G., Vass-Varnai, A., Gaal, L., & Rencz, M. (2019). Modeling of light emitting device populations in the electrical, thermal and optical domain for luminaire design. In ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019 (ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IPACK2019-6547