Modeling and simulation of LTCC lamination containing embedded channel

Eszter Horváth, Gábor Harsányi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Sag of laminated structures is a common problem in the processing of the low temperature co-fired ceramics (LTCC). The sacrificial layer (starch powder) densification during the lamination process of microfluidic structure fabrication in LTCC is described in the paper. The compressibility of sacrificial volume material (SVM) was measured in the function of pressure. A model was constituted which describes the sag of the covering LTCC layers. Based on these results, the maximum width of channel with tolerable sag can be determined. These results can be used to design with knowing the deformation failure of the LTCC laminate around the inner channel. Simulation of the LTCC lamination is demonstrated to show the ability of the proposed adaptive finite element approach.

Original languageEnglish
Title of host publicationConference Proceedings
Subtitle of host publication"New Trends in Micro/Nanotechnology" - 34th International Spring Seminar on Electronics Technology, ISSE 2011
Pages409-413
Number of pages5
DOIs
Publication statusPublished - Dec 12 2011
Event34th International Spring Seminar on Electronics Technology: "New Trends in Micro/Nanotechnology", ISSE 2011 - Tratanska Lomnica, Slovakia
Duration: May 11 2011May 15 2011

Publication series

NameProceedings of the International Spring Seminar on Electronics Technology
ISSN (Print)2161-2528
ISSN (Electronic)2161-2536

Other

Other34th International Spring Seminar on Electronics Technology: "New Trends in Micro/Nanotechnology", ISSE 2011
CountrySlovakia
CityTratanska Lomnica
Period5/11/115/15/11

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

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  • Cite this

    Horváth, E., & Harsányi, G. (2011). Modeling and simulation of LTCC lamination containing embedded channel. In Conference Proceedings: "New Trends in Micro/Nanotechnology" - 34th International Spring Seminar on Electronics Technology, ISSE 2011 (pp. 409-413). [6053897] (Proceedings of the International Spring Seminar on Electronics Technology). https://doi.org/10.1109/ISSE.2011.6053897