Microwave measurement of the stability of polyacetylene after encapsulation

S. Pekker, M. Bellec, X. Le Cleac'h, F. Beniere

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

The stability of the electrical conductivity of polyacetylene doped by iodine and encapsulated inside a plastic coating has been measured by a microwave technique. This method gives the average conductivity of the bulk of the polyacetylene sample inside the resin coating without any electrode. The encapsulation is proved to be an efficient way of increasing the stability because of combined beneficial effects. For high impurity contents, the escaping tendency of iodine is reduced by more than two orders of magnitude. Chemical degradation due to oxidation by air is prevented. The reaction of I2 which would give HI is also prevented, or at least limited. Encapsulated polyacetylene could therefore be used in industrial applications such as solid-state batteries where the quality of the polyacetylene electrodes has to be maitained over several years of storage.

Original languageEnglish
Pages (from-to)475-487
Number of pages13
JournalSynthetic Metals
Volume9
Issue number4
DOIs
Publication statusPublished - 1984

Fingerprint

Polyacetylenes
Microwave measurement
polyacetylene
Encapsulation
microwaves
Iodine
iodine
plastic coatings
Plastic coatings
Electrodes
electrodes
resins
Industrial applications
electric batteries
tendencies
Resins
Microwaves
Impurities
degradation
solid state

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Materials Chemistry
  • Polymers and Plastics

Cite this

Microwave measurement of the stability of polyacetylene after encapsulation. / Pekker, S.; Bellec, M.; Le Cleac'h, X.; Beniere, F.

In: Synthetic Metals, Vol. 9, No. 4, 1984, p. 475-487.

Research output: Contribution to journalArticle

Pekker, S. ; Bellec, M. ; Le Cleac'h, X. ; Beniere, F. / Microwave measurement of the stability of polyacetylene after encapsulation. In: Synthetic Metals. 1984 ; Vol. 9, No. 4. pp. 475-487.
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