Microstructure comparison of soldered joints using electrochemical selective etching

Tamás Hurtony, Attila Bonyár, Péter Gordon

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Citations (Scopus)

Abstract

The microstructure of the commonly used SnAgCu (SAC) lead free solder alloy was investigated. SAC solder bumps were soldered by two different soldering techniques (Vapor Phase Soldering (VPS), Laser reflow). Since the soldering profile of the VPS method is considerably different from the temperature profile of the laser reflow soldering, the created microstructures are expected to be diverse. Selective electrochemical etching was applied on cross sectional samples in order to extract the tin from the cross sectioning plane. In this manner the spatial structure of Cu6Sn5 and the Ag3Sn intermetllic compounds (IMCs) was highlighted. The microstructures of the samples were analyzed with optical microscopy and Scanning Electron Microscope (SEM) on cross-section samples. The composing elements were identified by SEM-EDS.

Original languageEnglish
Title of host publicationMaterials Science, Testing and Informatics VI
Pages367-372
Number of pages6
DOIs
Publication statusPublished - Jan 1 2013
Event8th Hungarian Conference on Materials Science - Balatonkenese, Hungary
Duration: Oct 9 2011Oct 11 2011

Publication series

NameMaterials Science Forum
Volume729
ISSN (Print)0255-5476

Other

Other8th Hungarian Conference on Materials Science
CountryHungary
CityBalatonkenese
Period10/9/1110/11/11

Keywords

  • Electrochemical etching
  • Intermetallic compound
  • Solder microstructure

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Hurtony, T., Bonyár, A., & Gordon, P. (2013). Microstructure comparison of soldered joints using electrochemical selective etching. In Materials Science, Testing and Informatics VI (pp. 367-372). (Materials Science Forum; Vol. 729). https://doi.org/10.4028/www.scientific.net/MSF.729.367