The microstructure of the commonly used SnAgCu (SAC) lead free solder alloy was investigated. SAC solder bumps were soldered by two different soldering techniques (Vapor Phase Soldering (VPS), Laser reflow). Since the soldering profile of the VPS method is considerably different from the temperature profile of the laser reflow soldering, the created microstructures are expected to be diverse. Selective electrochemical etching was applied on cross sectional samples in order to extract the tin from the cross sectioning plane. In this manner the spatial structure of Cu6Sn5 and the Ag3Sn intermetllic compounds (IMCs) was highlighted. The microstructures of the samples were analyzed with optical microscopy and Scanning Electron Microscope (SEM) on cross-section samples. The composing elements were identified by SEM-EDS.