Microstructure and mechanical behavior of ultrafine-grained titanium

J. Gubicza, Zs Fogarassy, Gy Krállics, J. Lábár, T. Törköly

Research output: Contribution to journalArticle

13 Citations (Scopus)

Abstract

Ultrafine-grained titanium was processed by severe plastic deformation (SPD). The SPD was carried out by equal channel angular pressing (ECAP) at high temperature. The ECAPprocessed sample was further deformed by conventional techniques such as radial forging and drawing. The microstructure was characterized quantitatively by X-ray diffraction line profile analysis and transmission electron microscopy after each step of deformation. The effect of procesing routes on the mechanical behavior was also studied. It was found that the conventional deformation processes after ECAP result in further increment in dislocation density and strength at the expense of ductility.

Original languageEnglish
Pages (from-to)99-104
Number of pages6
JournalMaterials Science Forum
Volume589
DOIs
Publication statusPublished - 2008

Fingerprint

Equal channel angular pressing
pressing
Titanium
plastic deformation
Plastic deformation
titanium
microstructure
Microstructure
forging
Forging
ductility
Ductility
routes
Transmission electron microscopy
X ray diffraction
transmission electron microscopy
profiles
diffraction
x rays
Temperature

Keywords

  • Drawing
  • Equal channel angular pressing (ECAP)
  • Mechanical properties
  • Microstructure
  • Radial forging
  • Titanium

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering
  • Mechanics of Materials

Cite this

Microstructure and mechanical behavior of ultrafine-grained titanium. / Gubicza, J.; Fogarassy, Zs; Krállics, Gy; Lábár, J.; Törköly, T.

In: Materials Science Forum, Vol. 589, 2008, p. 99-104.

Research output: Contribution to journalArticle

Gubicza, J. ; Fogarassy, Zs ; Krállics, Gy ; Lábár, J. ; Törköly, T. / Microstructure and mechanical behavior of ultrafine-grained titanium. In: Materials Science Forum. 2008 ; Vol. 589. pp. 99-104.
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