Microstructure and giant magnetoresistance of electrodeposited Co-Cu/Cu multilayers

L. Péter, A. Cziráki, L. Pogány, Z. Kupay, I. Bakonyi, M. Uhlemann, M. Herrich, B. Arnold, T. Bauer, K. Wetzig

Research output: Contribution to journalArticle

80 Citations (Scopus)

Abstract

Direct current plating, pulse plating, two-pulse plating, and reverse pulse plating were used to produce electrodeposited Co-Cu alloys and Co-Cu/Cu multilayers under galvanostatic control from an electrolyte containing CoSO 4 and CuSO4. Atomic force microscopy, X-ray diffraction, and transmission electron microscopy were used to study the sample structure and morphology. Direct current plating resulted in a Co95Cu5 alloy with nearly equal amounts of face-centered cubic (fcc) and hexagonal close packed phases, while all pulsed current methods yielded multilayers with fcc structure. Giant magnetoresistance (GMR) behavior was observed in the multilayers with a maximum magnetoresistance (MR) ratio of about 9% as measured at 8 kOe. The shape of the MR curves and the magnitude of the GMR were very similar, regardless of the sign of the current between the Co deposition pulses. The results of structural studies also confirmed the formation of a multilayer structure for each pulsed electrodeposition mode. The conclusion was that the spontaneous exchange reaction between Co and Cu2+ is responsible for the formation of a pure Cu layer even under reverse pulse plating conditions. The GMR of the multilayer deposits decreased with increasing bilayer number, due to the deterioration of the microstructure as the deposit grew.

Original languageEnglish
JournalJournal of the Electrochemical Society
Volume148
Issue number3
DOIs
Publication statusPublished - 2001

Fingerprint

Giant magnetoresistance
plating
Plating
Multilayers
microstructure
Microstructure
pulses
Magnetoresistance
Deposits
direct current
deposits
deterioration
Electrodeposition
electrodeposition
Electrolytes
laminates
Deterioration
Atomic force microscopy
atomic force microscopy
electrolytes

ASJC Scopus subject areas

  • Electrochemistry
  • Electronic, Optical and Magnetic Materials
  • Materials Chemistry
  • Surfaces, Coatings and Films
  • Renewable Energy, Sustainability and the Environment
  • Condensed Matter Physics

Cite this

Microstructure and giant magnetoresistance of electrodeposited Co-Cu/Cu multilayers. / Péter, L.; Cziráki, A.; Pogány, L.; Kupay, Z.; Bakonyi, I.; Uhlemann, M.; Herrich, M.; Arnold, B.; Bauer, T.; Wetzig, K.

In: Journal of the Electrochemical Society, Vol. 148, No. 3, 2001.

Research output: Contribution to journalArticle

@article{05aa9b9cc37d419688dec732c6e48407,
title = "Microstructure and giant magnetoresistance of electrodeposited Co-Cu/Cu multilayers",
abstract = "Direct current plating, pulse plating, two-pulse plating, and reverse pulse plating were used to produce electrodeposited Co-Cu alloys and Co-Cu/Cu multilayers under galvanostatic control from an electrolyte containing CoSO 4 and CuSO4. Atomic force microscopy, X-ray diffraction, and transmission electron microscopy were used to study the sample structure and morphology. Direct current plating resulted in a Co95Cu5 alloy with nearly equal amounts of face-centered cubic (fcc) and hexagonal close packed phases, while all pulsed current methods yielded multilayers with fcc structure. Giant magnetoresistance (GMR) behavior was observed in the multilayers with a maximum magnetoresistance (MR) ratio of about 9{\%} as measured at 8 kOe. The shape of the MR curves and the magnitude of the GMR were very similar, regardless of the sign of the current between the Co deposition pulses. The results of structural studies also confirmed the formation of a multilayer structure for each pulsed electrodeposition mode. The conclusion was that the spontaneous exchange reaction between Co and Cu2+ is responsible for the formation of a pure Cu layer even under reverse pulse plating conditions. The GMR of the multilayer deposits decreased with increasing bilayer number, due to the deterioration of the microstructure as the deposit grew.",
author = "L. P{\'e}ter and A. Czir{\'a}ki and L. Pog{\'a}ny and Z. Kupay and I. Bakonyi and M. Uhlemann and M. Herrich and B. Arnold and T. Bauer and K. Wetzig",
year = "2001",
doi = "10.1149/1.1346606",
language = "English",
volume = "148",
journal = "Journal of the Electrochemical Society",
issn = "0013-4651",
publisher = "Electrochemical Society, Inc.",
number = "3",

}

TY - JOUR

T1 - Microstructure and giant magnetoresistance of electrodeposited Co-Cu/Cu multilayers

AU - Péter, L.

AU - Cziráki, A.

AU - Pogány, L.

AU - Kupay, Z.

AU - Bakonyi, I.

AU - Uhlemann, M.

AU - Herrich, M.

AU - Arnold, B.

AU - Bauer, T.

AU - Wetzig, K.

PY - 2001

Y1 - 2001

N2 - Direct current plating, pulse plating, two-pulse plating, and reverse pulse plating were used to produce electrodeposited Co-Cu alloys and Co-Cu/Cu multilayers under galvanostatic control from an electrolyte containing CoSO 4 and CuSO4. Atomic force microscopy, X-ray diffraction, and transmission electron microscopy were used to study the sample structure and morphology. Direct current plating resulted in a Co95Cu5 alloy with nearly equal amounts of face-centered cubic (fcc) and hexagonal close packed phases, while all pulsed current methods yielded multilayers with fcc structure. Giant magnetoresistance (GMR) behavior was observed in the multilayers with a maximum magnetoresistance (MR) ratio of about 9% as measured at 8 kOe. The shape of the MR curves and the magnitude of the GMR were very similar, regardless of the sign of the current between the Co deposition pulses. The results of structural studies also confirmed the formation of a multilayer structure for each pulsed electrodeposition mode. The conclusion was that the spontaneous exchange reaction between Co and Cu2+ is responsible for the formation of a pure Cu layer even under reverse pulse plating conditions. The GMR of the multilayer deposits decreased with increasing bilayer number, due to the deterioration of the microstructure as the deposit grew.

AB - Direct current plating, pulse plating, two-pulse plating, and reverse pulse plating were used to produce electrodeposited Co-Cu alloys and Co-Cu/Cu multilayers under galvanostatic control from an electrolyte containing CoSO 4 and CuSO4. Atomic force microscopy, X-ray diffraction, and transmission electron microscopy were used to study the sample structure and morphology. Direct current plating resulted in a Co95Cu5 alloy with nearly equal amounts of face-centered cubic (fcc) and hexagonal close packed phases, while all pulsed current methods yielded multilayers with fcc structure. Giant magnetoresistance (GMR) behavior was observed in the multilayers with a maximum magnetoresistance (MR) ratio of about 9% as measured at 8 kOe. The shape of the MR curves and the magnitude of the GMR were very similar, regardless of the sign of the current between the Co deposition pulses. The results of structural studies also confirmed the formation of a multilayer structure for each pulsed electrodeposition mode. The conclusion was that the spontaneous exchange reaction between Co and Cu2+ is responsible for the formation of a pure Cu layer even under reverse pulse plating conditions. The GMR of the multilayer deposits decreased with increasing bilayer number, due to the deterioration of the microstructure as the deposit grew.

UR - http://www.scopus.com/inward/record.url?scp=0038066132&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0038066132&partnerID=8YFLogxK

U2 - 10.1149/1.1346606

DO - 10.1149/1.1346606

M3 - Article

AN - SCOPUS:0038066132

VL - 148

JO - Journal of the Electrochemical Society

JF - Journal of the Electrochemical Society

SN - 0013-4651

IS - 3

ER -