Microstructure and electrical properties of Ti-Si-C-Ag nanocomposite thin films

P. Eklund, T. Joelsson, H. Ljungcrantz, O. Wilhelmsson, Zs Czigány, H. Högberg, L. Hultman

Research output: Contribution to journalArticle

22 Citations (Scopus)

Abstract

Ti-Si-C-Ag nanocomposite coatings consisting of nanocrystalline TiC in an amorphous Si matrix with segregated Ag were deposited by dual magnetron sputtering from Ti3SiC2 and Ag targets. As evidenced by X-ray diffraction, scanning electron microscopy, and transmission electron microscopy, for Ag contents below 10 at.%, the Ag forms ∼ 10 nm large crystallites that are homogeneously distributed in the films. For higher Ag contents, coalescence during growth results in the formation of > ∼ 100 nm Ag islands on the film surface. The electrical resistivity of the coatings was measured in a four-point-probe setup, and ranged from 340 μΩcm (for Ti-Si-C coatings without Ag) to 40 μΩcm (for high Ag content).

Original languageEnglish
Pages (from-to)6465-6469
Number of pages5
JournalSurface and Coatings Technology
Volume201
Issue number14
DOIs
Publication statusPublished - Feb 4 2007

Keywords

  • Electron microscopy
  • Resistivity
  • Silver
  • Sputtering
  • Titanium carbide
  • X-ray diffraction

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

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    Eklund, P., Joelsson, T., Ljungcrantz, H., Wilhelmsson, O., Czigány, Z., Högberg, H., & Hultman, L. (2007). Microstructure and electrical properties of Ti-Si-C-Ag nanocomposite thin films. Surface and Coatings Technology, 201(14), 6465-6469. https://doi.org/10.1016/j.surfcoat.2006.12.016