Methodology for the inline die attach characterization of power leds

P. Szabo, A. Poppe, G. Farkas, M. Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Qualification of the die attach quality is a very important issue in case of Light Emitting Diodes (LEDs), as the operating temperature of these devices is usually much higher than that of usual silicon devices. Problems in the die attach quality result in significant reliability issues. For this reason the manufacturing line testing of these devices seems necessary. The usual structure function evaluation methodology that is regularly used for die attach qualification in after production testing is normally requiring several minutes for the testing of a device that is prohibitively long for inline testing. In this paper various solutions are proposed to overcome the lengthiness of the thermal transient testing and structure function evaluation methodology. With the proposed solutions the necessary time of problem detection is in the order of magnitude of milliseconds, enabling the methodology for production testing.

Original languageEnglish
Title of host publication2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007
Pages283-288
Number of pages6
DOIs
Publication statusPublished - Dec 1 2007
Event2007 ASME/JSME Thermal Engineering Summer Heat Transfer Conference, HT 2007 - Vancouver, BC, Canada
Duration: Jul 8 2007Jul 12 2007

Publication series

Name2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007
Volume3

Other

Other2007 ASME/JSME Thermal Engineering Summer Heat Transfer Conference, HT 2007
CountryCanada
CityVancouver, BC
Period7/8/077/12/07

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Condensed Matter Physics

Cite this

Szabo, P., Poppe, A., Farkas, G., & Rencz, M. (2007). Methodology for the inline die attach characterization of power leds. In 2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007 (pp. 283-288). (2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007; Vol. 3). https://doi.org/10.1115/HT2007-32622