Method for in-situ reliability testing of TIM samples

Andras Vass-Varnai, Zoltan Sarkany, M. Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

In this paper a possible method demonstrated for in-situ reliability testing of various TIM materials. The method is based on thermal transient measurements of a power semiconductor device in a TO-type package which has a flat, external cooling surface. By powering the junction of the semiconductor cyclically the whole assembly is exposed to intense thermal cycles in which the main heat-flow path leads through the TIM material. May the quality of the TIM change during the cycles the maximum junction temperature also changes.

Original languageEnglish
Title of host publication15th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2009
Pages219-223
Number of pages5
Publication statusPublished - 2009
Event15th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2009 - Leuven, Belgium
Duration: Oct 7 2009Oct 9 2009

Other

Other15th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2009
CountryBelgium
CityLeuven
Period10/7/0910/9/09

Fingerprint

Testing
Semiconductor materials
Heat transfer
Cooling
Temperature
Hot Temperature
Power semiconductor devices

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Vass-Varnai, A., Sarkany, Z., & Rencz, M. (2009). Method for in-situ reliability testing of TIM samples. In 15th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2009 (pp. 219-223). [5340050]

Method for in-situ reliability testing of TIM samples. / Vass-Varnai, Andras; Sarkany, Zoltan; Rencz, M.

15th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2009. 2009. p. 219-223 5340050.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Vass-Varnai, A, Sarkany, Z & Rencz, M 2009, Method for in-situ reliability testing of TIM samples. in 15th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2009., 5340050, pp. 219-223, 15th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2009, Leuven, Belgium, 10/7/09.
Vass-Varnai A, Sarkany Z, Rencz M. Method for in-situ reliability testing of TIM samples. In 15th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2009. 2009. p. 219-223. 5340050
Vass-Varnai, Andras ; Sarkany, Zoltan ; Rencz, M. / Method for in-situ reliability testing of TIM samples. 15th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2009. 2009. pp. 219-223
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