Metal film barriers against the evaporation of volatile components during the heat treatment of metal-compound semiconductor contacts

I. Mojzes, R. Veresegyházy, B. Kovács, B. Pécz, V. Malina

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InP samples covered with gold, Cr/Au, Ti/Au, Pd/Au, Pt/Au and Ni/Au metal films were heat treated in vacuum, and the evaporation of volatile components was monitored in situ with a mass spectrometer. In the case of Au-In samples, the interaction of gold with InP results in a large evaporation of the volatile component. It was found that chromium and titanium act as an effective barrier against this interaction. Nickel and platinum do not give rise to volatile component loss peaks but they are not effective barrier films to hinder the diffusion of gold. However, palladium promotes the decomposition of InP. This means that chromium and titanium should be preferred in contact systems as barrier metal films.

Original languageEnglish
Pages (from-to)1-4
Number of pages4
JournalThin Solid Films
Issue numberC
Publication statusPublished - Oct 1988


ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

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