MEMS-compatible hard coating technique of moveable 3D silicon microstructures

Z. Fekete, P. Fürjes, T. Kárpáti, G. A B Gál, I. Rajta

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Mechanical degradation of mobile silicon components of complex MEMS reduces device reliability and operation time. Although the considerable wear of the surface micromachined poly-crystalline elements can be decreased by substitution of crystalline-silicon-based equivalent, there is still room for further improvement in device durability. The demonstration device is the recently presented 3D crystalline silicon micro-turbine formed by the combination of proton beam writing (PBW) and subsequent selective porous silicon (PorSi) etching. Similarly to the DRIE (deep reactive ion etching) process the novel technique is capable to provide elements of vertical walls of high aspect ratio. The 3D silicon components were uniformly covered with LPCVD Si 3N4 protective layer. The Si3N4 coating improves the chemical and mechanical properties; strength, hardness and chemical resistance. The elaborated processing technology can easily be adapted for deposition of protective materials of superior properties, e.g. TiN and DLC (diamond like carbon). Present work describes alternative hard coating technique integrated in the MEMS processing sequence. The feasibility of the proposed technique is demonstrated by preliminary qualitative wear tests.

Original languageEnglish
Title of host publicationMaterials Science Forum
Pages147-152
Number of pages6
Volume659
DOIs
Publication statusPublished - 2010
Event7th Hungarian Conference on Materials Science - Balatonkenese, Hungary
Duration: Oct 11 2009Oct 13 2009

Publication series

NameMaterials Science Forum
Volume659
ISSN (Print)02555476

Other

Other7th Hungarian Conference on Materials Science
CountryHungary
CityBalatonkenese
Period10/11/0910/13/09

Fingerprint

Hard coatings
Coating techniques
Silicon
microelectromechanical systems
MEMS
coating
microstructure
Microstructure
silicon
Crystalline materials
Wear of materials
etching
Diamond
Proton beams
Chemical resistance
wear tests
Porous silicon
Reactive ion etching
turbines
Processing

Keywords

  • Hard coating
  • Micromachining
  • PBW
  • Porous silicon

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanical Engineering
  • Mechanics of Materials

Cite this

Fekete, Z., Fürjes, P., Kárpáti, T., Gál, G. A. B., & Rajta, I. (2010). MEMS-compatible hard coating technique of moveable 3D silicon microstructures. In Materials Science Forum (Vol. 659, pp. 147-152). (Materials Science Forum; Vol. 659). https://doi.org/10.4028/www.scientific.net/MSF.659.147

MEMS-compatible hard coating technique of moveable 3D silicon microstructures. / Fekete, Z.; Fürjes, P.; Kárpáti, T.; Gál, G. A B; Rajta, I.

Materials Science Forum. Vol. 659 2010. p. 147-152 (Materials Science Forum; Vol. 659).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fekete, Z, Fürjes, P, Kárpáti, T, Gál, GAB & Rajta, I 2010, MEMS-compatible hard coating technique of moveable 3D silicon microstructures. in Materials Science Forum. vol. 659, Materials Science Forum, vol. 659, pp. 147-152, 7th Hungarian Conference on Materials Science, Balatonkenese, Hungary, 10/11/09. https://doi.org/10.4028/www.scientific.net/MSF.659.147
Fekete, Z. ; Fürjes, P. ; Kárpáti, T. ; Gál, G. A B ; Rajta, I. / MEMS-compatible hard coating technique of moveable 3D silicon microstructures. Materials Science Forum. Vol. 659 2010. pp. 147-152 (Materials Science Forum).
@inproceedings{947b18c580594047a8dc90761fbe4368,
title = "MEMS-compatible hard coating technique of moveable 3D silicon microstructures",
abstract = "Mechanical degradation of mobile silicon components of complex MEMS reduces device reliability and operation time. Although the considerable wear of the surface micromachined poly-crystalline elements can be decreased by substitution of crystalline-silicon-based equivalent, there is still room for further improvement in device durability. The demonstration device is the recently presented 3D crystalline silicon micro-turbine formed by the combination of proton beam writing (PBW) and subsequent selective porous silicon (PorSi) etching. Similarly to the DRIE (deep reactive ion etching) process the novel technique is capable to provide elements of vertical walls of high aspect ratio. The 3D silicon components were uniformly covered with LPCVD Si 3N4 protective layer. The Si3N4 coating improves the chemical and mechanical properties; strength, hardness and chemical resistance. The elaborated processing technology can easily be adapted for deposition of protective materials of superior properties, e.g. TiN and DLC (diamond like carbon). Present work describes alternative hard coating technique integrated in the MEMS processing sequence. The feasibility of the proposed technique is demonstrated by preliminary qualitative wear tests.",
keywords = "Hard coating, Micromachining, PBW, Porous silicon",
author = "Z. Fekete and P. F{\"u}rjes and T. K{\'a}rp{\'a}ti and G{\'a}l, {G. A B} and I. Rajta",
year = "2010",
doi = "10.4028/www.scientific.net/MSF.659.147",
language = "English",
isbn = "0878492356",
volume = "659",
series = "Materials Science Forum",
pages = "147--152",
booktitle = "Materials Science Forum",

}

TY - GEN

T1 - MEMS-compatible hard coating technique of moveable 3D silicon microstructures

AU - Fekete, Z.

AU - Fürjes, P.

AU - Kárpáti, T.

AU - Gál, G. A B

AU - Rajta, I.

PY - 2010

Y1 - 2010

N2 - Mechanical degradation of mobile silicon components of complex MEMS reduces device reliability and operation time. Although the considerable wear of the surface micromachined poly-crystalline elements can be decreased by substitution of crystalline-silicon-based equivalent, there is still room for further improvement in device durability. The demonstration device is the recently presented 3D crystalline silicon micro-turbine formed by the combination of proton beam writing (PBW) and subsequent selective porous silicon (PorSi) etching. Similarly to the DRIE (deep reactive ion etching) process the novel technique is capable to provide elements of vertical walls of high aspect ratio. The 3D silicon components were uniformly covered with LPCVD Si 3N4 protective layer. The Si3N4 coating improves the chemical and mechanical properties; strength, hardness and chemical resistance. The elaborated processing technology can easily be adapted for deposition of protective materials of superior properties, e.g. TiN and DLC (diamond like carbon). Present work describes alternative hard coating technique integrated in the MEMS processing sequence. The feasibility of the proposed technique is demonstrated by preliminary qualitative wear tests.

AB - Mechanical degradation of mobile silicon components of complex MEMS reduces device reliability and operation time. Although the considerable wear of the surface micromachined poly-crystalline elements can be decreased by substitution of crystalline-silicon-based equivalent, there is still room for further improvement in device durability. The demonstration device is the recently presented 3D crystalline silicon micro-turbine formed by the combination of proton beam writing (PBW) and subsequent selective porous silicon (PorSi) etching. Similarly to the DRIE (deep reactive ion etching) process the novel technique is capable to provide elements of vertical walls of high aspect ratio. The 3D silicon components were uniformly covered with LPCVD Si 3N4 protective layer. The Si3N4 coating improves the chemical and mechanical properties; strength, hardness and chemical resistance. The elaborated processing technology can easily be adapted for deposition of protective materials of superior properties, e.g. TiN and DLC (diamond like carbon). Present work describes alternative hard coating technique integrated in the MEMS processing sequence. The feasibility of the proposed technique is demonstrated by preliminary qualitative wear tests.

KW - Hard coating

KW - Micromachining

KW - PBW

KW - Porous silicon

UR - http://www.scopus.com/inward/record.url?scp=78649949409&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=78649949409&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/MSF.659.147

DO - 10.4028/www.scientific.net/MSF.659.147

M3 - Conference contribution

AN - SCOPUS:78649949409

SN - 0878492356

SN - 9780878492350

VL - 659

T3 - Materials Science Forum

SP - 147

EP - 152

BT - Materials Science Forum

ER -