Measuring thickness based on the grayscale value of C-mode SAM images

Endre Harkai, Péter Gordon

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Scanning acoustic microscopy is an analysis tool capable for revealing the inner structure of the samples and detecting inhomogeneities inside them, for material characterization and for measuring the thickness of a given layer. A standard method for thickness measurements is based on observing a so called A-mode echo signal. In this paper the authors present pilot results of a method for thickness measurements based on analyzing the grayscale value of the C-mode image. The method can be used only under certain circumstances, but has the advantage to estimate the thickness of a layer using only the C-mode image.

Original languageEnglish
Title of host publication2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011 - Conference Proceedings
Pages319-322
Number of pages4
DOIs
Publication statusPublished - Dec 1 2011
Event2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011 - Timisoara, Romania
Duration: Oct 20 2011Oct 23 2011

Publication series

Name2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011 - Conference Proceedings

Conference

Conference2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011
CountryRomania
CityTimisoara
Period10/20/1110/23/11

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Keywords

  • Scanning Acoustic Microscopy
  • grayscale image processing
  • measuring thickness

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Polymers and Plastics

Cite this

Harkai, E., & Gordon, P. (2011). Measuring thickness based on the grayscale value of C-mode SAM images. In 2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011 - Conference Proceedings (pp. 319-322). [6102744] (2011 IEEE 17th International Symposium for Design and Technology of Electronics Packages, SIITME 2011 - Conference Proceedings). https://doi.org/10.1109/SIITME.2011.6102744