Measuring partial thermal resistances in a heat-flow path

Research output: Contribution to journalArticle

95 Citations (Scopus)

Abstract

The paper presents how to measure partial steady state thermal resistance values in a heat flow path with the help of thermal transient measurements and the subsequent numerical evaluation. The method is based on the further evaluation of the structure functions of the heat flow path. After presenting the theoretical background of the evaluation two different practical examples are presented to demonstrate the use of the method. The first example presents with a series of experiments how to use the method to detect die attach and/or soldering failures in packaged devices. The second example demonstrates that the method can be applied to measure the very small Rth values of thin conducting layers. Various practical solutions are discussed and demonstrated by simulations. The chances and the limits of the methodology are discussed in details in the conclusion section.

Original languageEnglish
Pages (from-to)547-553
Number of pages7
JournalIEEE Transactions on Components and Packaging Technologies
Volume25
Issue number4
DOIs
Publication statusPublished - 2002

Fingerprint

Heat resistance
Heat transfer
Soldering
Experiments
Hot Temperature

Keywords

  • Die attach qualification
  • Die attach quality
  • Interface thermal resistance
  • Partial thermal resistance
  • Soldering failure
  • Structure function
  • Thermal transient evaluation
  • Thermal transient measurement
  • Transient thermal testing

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Materials Science(all)

Cite this

Measuring partial thermal resistances in a heat-flow path. / Rencz, M.; Székely, V.

In: IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 4, 2002, p. 547-553.

Research output: Contribution to journalArticle

@article{7faee1e54c4c4684acdd7f8af4565112,
title = "Measuring partial thermal resistances in a heat-flow path",
abstract = "The paper presents how to measure partial steady state thermal resistance values in a heat flow path with the help of thermal transient measurements and the subsequent numerical evaluation. The method is based on the further evaluation of the structure functions of the heat flow path. After presenting the theoretical background of the evaluation two different practical examples are presented to demonstrate the use of the method. The first example presents with a series of experiments how to use the method to detect die attach and/or soldering failures in packaged devices. The second example demonstrates that the method can be applied to measure the very small Rth values of thin conducting layers. Various practical solutions are discussed and demonstrated by simulations. The chances and the limits of the methodology are discussed in details in the conclusion section.",
keywords = "Die attach qualification, Die attach quality, Interface thermal resistance, Partial thermal resistance, Soldering failure, Structure function, Thermal transient evaluation, Thermal transient measurement, Transient thermal testing",
author = "M. Rencz and V. Sz{\'e}kely",
year = "2002",
doi = "10.1109/TCAPT.2002.808003",
language = "English",
volume = "25",
pages = "547--553",
journal = "IEEE Transactions on Components and Packaging Technologies",
issn = "1521-3331",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "4",

}

TY - JOUR

T1 - Measuring partial thermal resistances in a heat-flow path

AU - Rencz, M.

AU - Székely, V.

PY - 2002

Y1 - 2002

N2 - The paper presents how to measure partial steady state thermal resistance values in a heat flow path with the help of thermal transient measurements and the subsequent numerical evaluation. The method is based on the further evaluation of the structure functions of the heat flow path. After presenting the theoretical background of the evaluation two different practical examples are presented to demonstrate the use of the method. The first example presents with a series of experiments how to use the method to detect die attach and/or soldering failures in packaged devices. The second example demonstrates that the method can be applied to measure the very small Rth values of thin conducting layers. Various practical solutions are discussed and demonstrated by simulations. The chances and the limits of the methodology are discussed in details in the conclusion section.

AB - The paper presents how to measure partial steady state thermal resistance values in a heat flow path with the help of thermal transient measurements and the subsequent numerical evaluation. The method is based on the further evaluation of the structure functions of the heat flow path. After presenting the theoretical background of the evaluation two different practical examples are presented to demonstrate the use of the method. The first example presents with a series of experiments how to use the method to detect die attach and/or soldering failures in packaged devices. The second example demonstrates that the method can be applied to measure the very small Rth values of thin conducting layers. Various practical solutions are discussed and demonstrated by simulations. The chances and the limits of the methodology are discussed in details in the conclusion section.

KW - Die attach qualification

KW - Die attach quality

KW - Interface thermal resistance

KW - Partial thermal resistance

KW - Soldering failure

KW - Structure function

KW - Thermal transient evaluation

KW - Thermal transient measurement

KW - Transient thermal testing

UR - http://www.scopus.com/inward/record.url?scp=0037004307&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0037004307&partnerID=8YFLogxK

U2 - 10.1109/TCAPT.2002.808003

DO - 10.1109/TCAPT.2002.808003

M3 - Article

AN - SCOPUS:0037004307

VL - 25

SP - 547

EP - 553

JO - IEEE Transactions on Components and Packaging Technologies

JF - IEEE Transactions on Components and Packaging Technologies

SN - 1521-3331

IS - 4

ER -