Measuring interface thermal resistance values by transient testing

M. Rencz, V. Székely, G. Farkas, B. Courtois

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

A method is presented for detecting increased thermal resistance values within a heat conduction path with the help of transient thermal measurements. After summarizing the theoretical background of structure function evaluation it is demonstrated how to determine partial thermal resistances in the cases when one dimensional heat flow may be assumed. The paper presents a typical structure developed to measure small thermal resistance values with the help of the presented method. Simulated results demonstrate the feasibility of the suggested method, and measured examples demonstrate the applicability.

Original languageEnglish
Title of host publicationInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
PublisherIEEE Computer Society
Pages136-141
Number of pages6
Volume2002-January
ISBN (Print)0780371526
DOIs
Publication statusPublished - 2002
Event8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002 - San Diego, United States
Duration: May 30 2002Jun 1 2002

Other

Other8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002
CountryUnited States
CitySan Diego
Period5/30/026/1/02

Keywords

  • Area measurement
  • Capacitance measurement
  • Conductivity measurement
  • Density measurement
  • Electrical resistance measurement
  • Resistance heating
  • Testing
  • Thermal conductivity
  • Thermal resistance
  • Time measurement

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Rencz, M., Székely, V., Farkas, G., & Courtois, B. (2002). Measuring interface thermal resistance values by transient testing. In InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM (Vol. 2002-January, pp. 136-141). [1012449] IEEE Computer Society. https://doi.org/10.1109/ITHERM.2002.1012449