Measuring interface thermal resistance values by transient testing

Marta Rencz, Vladimir Székely, Gabor Farkas, Bernard Courtois

Research output: Contribution to conferencePaper

Abstract

A method is presented for detecting increased thermal resistance values within a heat conduction path with the help of transient thermal measurements. After summarizing the theoretical background of structure function evaluation it is demonstrated how to determine partial thermal resistances in the cases when one dimensional heat flow may be assumed. The paper presents a typical structure developed to measure small thermal resistance values with the help of the presented method. Simulated results demonstrate the feasibility of the suggested method, and measured examples demonstrate the applicability.

Original languageEnglish
Pages136-141
Number of pages6
Publication statusPublished - Jan 1 2002
Event8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems - San Diego, CA, United States
Duration: May 30 2002Jun 1 2002

Other

Other8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems
CountryUnited States
CitySan Diego, CA
Period5/30/026/1/02

Keywords

  • Die attach problems
  • Interface thermal resistance
  • Partial thermal resistance
  • Structure function
  • Thermal transient measurements
  • Transient thermal testing

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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  • Cite this

    Rencz, M., Székely, V., Farkas, G., & Courtois, B. (2002). Measuring interface thermal resistance values by transient testing. 136-141. Paper presented at 8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems, San Diego, CA, United States.