Measurement based compact thermal model creation - Accurate approach to neglect inaccurate TIM conductivity data

Andras Vass-Varnai, Robin Bornoff, Zoltan Sarkany, Sandor Ress, M. Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

14 Citations (Scopus)

Abstract

In this paper two possible ways are investigated to create accurate thermal models without having validated information on the thermal properties of the applied thermal interface materials. One way is the calibration of a detailed numerical thermal model based on the physical information which can be derived from experimental structure functions. In the paper we show a complete calibration procedure using a TO-220 package as an example. Another approach is the generation of dynamic compact models based on real measurements. In order to apply this approach one has to identify the junction-to-case thermal resistance of the tested package using the JEDEC JESD 51-14 standard.

Original languageEnglish
Title of host publication2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
Pages67-72
Number of pages6
DOIs
Publication statusPublished - 2011
Event2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011 - Singapore, Singapore
Duration: Dec 7 2011Dec 9 2011

Other

Other2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
CountrySingapore
CitySingapore
Period12/7/1112/9/11

Fingerprint

Calibration
Heat resistance
Thermodynamic properties
Hot Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Vass-Varnai, A., Bornoff, R., Sarkany, Z., Ress, S., & Rencz, M. (2011). Measurement based compact thermal model creation - Accurate approach to neglect inaccurate TIM conductivity data. In 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011 (pp. 67-72). [6184388] https://doi.org/10.1109/EPTC.2011.6184388

Measurement based compact thermal model creation - Accurate approach to neglect inaccurate TIM conductivity data. / Vass-Varnai, Andras; Bornoff, Robin; Sarkany, Zoltan; Ress, Sandor; Rencz, M.

2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011. 2011. p. 67-72 6184388.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Vass-Varnai, A, Bornoff, R, Sarkany, Z, Ress, S & Rencz, M 2011, Measurement based compact thermal model creation - Accurate approach to neglect inaccurate TIM conductivity data. in 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011., 6184388, pp. 67-72, 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011, Singapore, Singapore, 12/7/11. https://doi.org/10.1109/EPTC.2011.6184388
Vass-Varnai A, Bornoff R, Sarkany Z, Ress S, Rencz M. Measurement based compact thermal model creation - Accurate approach to neglect inaccurate TIM conductivity data. In 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011. 2011. p. 67-72. 6184388 https://doi.org/10.1109/EPTC.2011.6184388
Vass-Varnai, Andras ; Bornoff, Robin ; Sarkany, Zoltan ; Ress, Sandor ; Rencz, M. / Measurement based compact thermal model creation - Accurate approach to neglect inaccurate TIM conductivity data. 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011. 2011. pp. 67-72
@inproceedings{58ca54865815457995259d5c85887a46,
title = "Measurement based compact thermal model creation - Accurate approach to neglect inaccurate TIM conductivity data",
abstract = "In this paper two possible ways are investigated to create accurate thermal models without having validated information on the thermal properties of the applied thermal interface materials. One way is the calibration of a detailed numerical thermal model based on the physical information which can be derived from experimental structure functions. In the paper we show a complete calibration procedure using a TO-220 package as an example. Another approach is the generation of dynamic compact models based on real measurements. In order to apply this approach one has to identify the junction-to-case thermal resistance of the tested package using the JEDEC JESD 51-14 standard.",
author = "Andras Vass-Varnai and Robin Bornoff and Zoltan Sarkany and Sandor Ress and M. Rencz",
year = "2011",
doi = "10.1109/EPTC.2011.6184388",
language = "English",
isbn = "9781457719837",
pages = "67--72",
booktitle = "2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011",

}

TY - GEN

T1 - Measurement based compact thermal model creation - Accurate approach to neglect inaccurate TIM conductivity data

AU - Vass-Varnai, Andras

AU - Bornoff, Robin

AU - Sarkany, Zoltan

AU - Ress, Sandor

AU - Rencz, M.

PY - 2011

Y1 - 2011

N2 - In this paper two possible ways are investigated to create accurate thermal models without having validated information on the thermal properties of the applied thermal interface materials. One way is the calibration of a detailed numerical thermal model based on the physical information which can be derived from experimental structure functions. In the paper we show a complete calibration procedure using a TO-220 package as an example. Another approach is the generation of dynamic compact models based on real measurements. In order to apply this approach one has to identify the junction-to-case thermal resistance of the tested package using the JEDEC JESD 51-14 standard.

AB - In this paper two possible ways are investigated to create accurate thermal models without having validated information on the thermal properties of the applied thermal interface materials. One way is the calibration of a detailed numerical thermal model based on the physical information which can be derived from experimental structure functions. In the paper we show a complete calibration procedure using a TO-220 package as an example. Another approach is the generation of dynamic compact models based on real measurements. In order to apply this approach one has to identify the junction-to-case thermal resistance of the tested package using the JEDEC JESD 51-14 standard.

UR - http://www.scopus.com/inward/record.url?scp=84860904687&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84860904687&partnerID=8YFLogxK

U2 - 10.1109/EPTC.2011.6184388

DO - 10.1109/EPTC.2011.6184388

M3 - Conference contribution

SN - 9781457719837

SP - 67

EP - 72

BT - 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

ER -