Material design aspects of high reliability, high density interconnections

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Material design aspects of high density interconnects in multichip modules (MCMs) generally concentrate on processing and bonding compatibility, maximum yield and cost effectiveness. Reliability and failure analysis investigations focus mainly on bonding and chip level problems. Only a few studies have dealt with reliability problems arising from the interconnection substrates themselves, and even less work has been devoted to obtaining feedback for the material design. However, the new or repeatedly 'discovered' material systems in MCMs need more detailed discussion. This paper concentrates on the material selection problem in order to minimize short circuit failure formation possibilities for various MCM interconnection substrates, chip bonding and packaging types, considering also processing compatibility and cost aspects as well.

Original languageEnglish
Pages (from-to)120-123
Number of pages4
JournalMaterials Chemistry and Physics
Volume45
Issue number2
DOIs
Publication statusPublished - Aug 1996

Fingerprint

Multichip modules
modules
compatibility
chips
reliability analysis
materials selection
cost effectiveness
failure analysis
short circuits
packaging
Substrates
Cost effectiveness
Reliability analysis
Processing
Short circuit currents
Failure analysis
costs
Packaging
Feedback
Costs

Keywords

  • Interconnections
  • Material design
  • Multichip modules

ASJC Scopus subject areas

  • Materials Chemistry

Cite this

Material design aspects of high reliability, high density interconnections. / Harsányi, G.

In: Materials Chemistry and Physics, Vol. 45, No. 2, 08.1996, p. 120-123.

Research output: Contribution to journalArticle

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