Mapping heat conduction ability of big SMDs with Dijsktra Algorithm

Balázs Illés, Gábor Harsányi

Research output: Contribution to journalArticle

1 Citation (Scopus)


In this paper we present how the graph theory can be used in the field of thermal study. We have developed a method which can describe the heat conduction ability of big Surface Mounted Devices (SMDs) during the reflow soldering process. Our method established that the heat conduction ability of the materials can be described with time coefficients. These time coefficients are determined by the thermal resistance and the heat capacity of the examined materials. We implemented our method in a Matlab 7.0 program which generates a directed and weighted graph from the discrete thermal model of the investigated SMD. The program uses Dijsktra Algorithm to find the shortest "conduction path" between the different parts of the component. With our method, the following effects can be studied during the reflow soldering process: from which points and which paths can the most effective heating of a chosen contact surface be achieved, the differences between the shortest conduction paths and the effect of heat distraction.

Original languageEnglish
Pages (from-to)185-192
Number of pages8
JournalMicro and Nanosystems
Issue number3
Publication statusPublished - Jan 1 2010


  • Dijsktra algorithm
  • Heat conduction
  • Reflow soldering
  • Thermal modelling

ASJC Scopus subject areas

  • Building and Construction

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