Makyoh topography for the morphological study of compound semiconductor wafers and structures

Research output: Contribution to journalArticle

23 Citations (Scopus)

Abstract

The basic imaging principles as well as the potential application of Makyoh topography for the assessment of flatness and overall curvature of semiconductor wafers and layer structures are reviewed. The topography was used for the assessment of flatness and overall curvature of the wafers. Results proved that Makyoh topography is a simple, fast and non-expensive tool for the routine assessment of compound semiconductor structures.

Original languageEnglish
Pages (from-to)220-223
Number of pages4
JournalMaterials Science and Engineering B
Volume80
Issue number1-3
DOIs
Publication statusPublished - Mar 22 2001

Fingerprint

Topography
topography
wafers
flatness
Semiconductor materials
curvature
Imaging techniques

Keywords

  • Compound semiconductors
  • Curvature measurement
  • Makyoh topography
  • Surface flatness

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Makyoh topography for the morphological study of compound semiconductor wafers and structures. / Riesz, F.

In: Materials Science and Engineering B, Vol. 80, No. 1-3, 22.03.2001, p. 220-223.

Research output: Contribution to journalArticle

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