Mössbauer study of interphase formation at the interface of electrodeposited tin on silver and platinum

H. Mehner, A. Vértes

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

During electrodeposition of Sn on Ag substrate an interphase formation /electroimplantation/ could be observed. The average thickness of the formed alloy amounts to ∼35 nm. Heat treatment increases the thickness of the interphase, the activation energy of the interdiffusion process is 45.5±2 kJ mol-1. The system Sn on Pt substrate showed no electroimplantation. The diffusion during heat treatment has an activation energy of 126.2±2 kJ mol-1. Isomer shift of the formed alloys indicates that Pt diffuses preferentially into the tin layer.

Original languageEnglish
Pages (from-to)353-361
Number of pages9
JournalJournal of Radioanalytical and Nuclear Chemistry Letters
Volume96
Issue number4
DOIs
Publication statusPublished - Nov 1 1985

ASJC Scopus subject areas

  • Analytical Chemistry
  • Nuclear Energy and Engineering
  • Radiology Nuclear Medicine and imaging
  • Pollution
  • Spectroscopy
  • Public Health, Environmental and Occupational Health
  • Health, Toxicology and Mutagenesis

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