Low order compact model development for LED package thermal investigation

Márton Németh, A. Poppe

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper we present a new computational method for calculating thermal transfer impedances between a few separate locations of a given physical structure aimed at the implementation into a field-solver based on the SUNRED (SUccessive Node REDuction) algorithm. The order reduction was done by the balanced truncation method. We tested the method on a simplified LED package in 3D. Results obtained by the proposed new calculation method and results obtained by the conventional numerical simulation are compared and the error was estimated based on the difference of these results. Based on that comparison we found that the proposed method is fast and accurate.

Original languageEnglish
Title of host publicationTHERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-5
Number of pages5
Volume2017-January
ISBN (Electronic)9781538619285
DOIs
Publication statusPublished - Dec 21 2017
Event23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017 - Amsterdam, Netherlands
Duration: Sep 27 2017Sep 29 2017

Other

Other23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017
CountryNetherlands
CityAmsterdam
Period9/27/179/29/17

Fingerprint

Light emitting diodes
Computational methods
Balanced Truncation
Order Reduction
Computer simulation
Model
Computational Methods
Impedance
Numerical Simulation
Hot Temperature
Vertex of a graph

ASJC Scopus subject areas

  • Safety, Risk, Reliability and Quality
  • Modelling and Simulation
  • Electrical and Electronic Engineering

Cite this

Németh, M., & Poppe, A. (2017). Low order compact model development for LED package thermal investigation. In THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems (Vol. 2017-January, pp. 1-5). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/THERMINIC.2017.8233792

Low order compact model development for LED package thermal investigation. / Németh, Márton; Poppe, A.

THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems. Vol. 2017-January Institute of Electrical and Electronics Engineers Inc., 2017. p. 1-5.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Németh, M & Poppe, A 2017, Low order compact model development for LED package thermal investigation. in THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems. vol. 2017-January, Institute of Electrical and Electronics Engineers Inc., pp. 1-5, 23rd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2017, Amsterdam, Netherlands, 9/27/17. https://doi.org/10.1109/THERMINIC.2017.8233792
Németh M, Poppe A. Low order compact model development for LED package thermal investigation. In THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems. Vol. 2017-January. Institute of Electrical and Electronics Engineers Inc. 2017. p. 1-5 https://doi.org/10.1109/THERMINIC.2017.8233792
Németh, Márton ; Poppe, A. / Low order compact model development for LED package thermal investigation. THERMINIC 2017 - 23rd International Workshop on Thermal Investigations of ICs and Systems. Vol. 2017-January Institute of Electrical and Electronics Engineers Inc., 2017. pp. 1-5
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