Logi-thermal simulation using high-resolution temperature dependent delay models

Andras Timar, M. Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

This paper proposes an accurate temperature dependent delay model for logi-thermal simulations. During the logi-thermal simulation of digital integrated circuits the propagation delays of the standard cells can be calculated from delay-temperature functions. The delay-temperature functions contain exact and precise delay values for each input-output path and temperature value. Temperature characterization corners can be specified in arbitrary fine granularity and range. The model presented in this paper overcome the limitation of the classic SDF (Standard Delay Format) models in that propagation delay values can be given for arbitrary temperatures, not only a few corners. With classic SDF, temperature dependence of timing and thus power can only be taken into account for a few design corners. Between characterization corners, like supply voltage, process variation and temperature, linear interpolation must be used for intermediate data. With our proposed delay model temperature-aware timing simulations would produce more accurate results than the classic SDF model. This paper compares the classic SDF delay model with our temperature dependent detailed model and provides evidence through a simple example for the necessity of temperature-aware timing simulation. The logi-thermal simulations are carried out with the CellTherm[1] application developed in the Dept. of Electron Devices, BME, Hungary. A logi-thermal acceleration technique is also introduced in this paper.

Original languageEnglish
Title of host publicationTHERMINIC 2013 - 19th International Workshop on Thermal Investigations of ICs and Systems, Proceedings
PublisherIEEE Computer Society
Pages376-380
Number of pages5
DOIs
Publication statusPublished - 2013
Event19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013 - Berlin, Germany
Duration: Sep 25 2013Sep 27 2013

Other

Other19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013
CountryGermany
CityBerlin
Period9/25/139/27/13

Fingerprint

Temperature
Hot Temperature
Digital integrated circuits
Electron devices
Interpolation
Electric potential

ASJC Scopus subject areas

  • Hardware and Architecture

Cite this

Timar, A., & Rencz, M. (2013). Logi-thermal simulation using high-resolution temperature dependent delay models. In THERMINIC 2013 - 19th International Workshop on Thermal Investigations of ICs and Systems, Proceedings (pp. 376-380). [6675214] IEEE Computer Society. https://doi.org/10.1109/THERMINIC.2013.6675214

Logi-thermal simulation using high-resolution temperature dependent delay models. / Timar, Andras; Rencz, M.

THERMINIC 2013 - 19th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. IEEE Computer Society, 2013. p. 376-380 6675214.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Timar, A & Rencz, M 2013, Logi-thermal simulation using high-resolution temperature dependent delay models. in THERMINIC 2013 - 19th International Workshop on Thermal Investigations of ICs and Systems, Proceedings., 6675214, IEEE Computer Society, pp. 376-380, 19th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2013, Berlin, Germany, 9/25/13. https://doi.org/10.1109/THERMINIC.2013.6675214
Timar A, Rencz M. Logi-thermal simulation using high-resolution temperature dependent delay models. In THERMINIC 2013 - 19th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. IEEE Computer Society. 2013. p. 376-380. 6675214 https://doi.org/10.1109/THERMINIC.2013.6675214
Timar, Andras ; Rencz, M. / Logi-thermal simulation using high-resolution temperature dependent delay models. THERMINIC 2013 - 19th International Workshop on Thermal Investigations of ICs and Systems, Proceedings. IEEE Computer Society, 2013. pp. 376-380
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