Lifetime estimation of power electronics modules considering the target application

Attila Szel, Zoltan Sarkany, Marton Bein, Robin Bornoff, Andras Vass-Varnai, Marta Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

The design of power electronics modules and power packages is heavily influenced by thermal concerns. New substrate materials, thinner and thermally more conductive attachment materials are used to decrease the thermal resistance of a given module. When a new material or technology is applied, its reliability has to be tested thoroughly before the module can be considered for production. The reliability or the expected lifetime of the module can be expressed by a number of temperature or power cycles the system can withstand. These numbers however make more sense if they can be linked to the foreseen lifetime of the application where the power module will be applied. In our changing industrial environment the design of power modules is not aimed at maximum lifetime anymore, but it is determined by the application itself. In this article we will summarize the steps which take the designer from the application requirements (mission profile) to the expected lifetime of the application considering the reliability of the power modules used.

Original languageEnglish
Title of host publication31st Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2015 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages332-335
Number of pages4
ISBN (Electronic)9781479986002
DOIs
Publication statusPublished - Apr 30 2015
Event31st Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2015 - San Jose, United States
Duration: Mar 15 2015Mar 19 2015

Publication series

NameAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
Volume2015-April
ISSN (Print)1065-2221

Other

Other31st Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2015
CountryUnited States
CitySan Jose
Period3/15/153/19/15

Keywords

  • Power electronics
  • lifetime calculation
  • mission profile
  • temperature cycling
  • thermal simulation

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering

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  • Cite this

    Szel, A., Sarkany, Z., Bein, M., Bornoff, R., Vass-Varnai, A., & Rencz, M. (2015). Lifetime estimation of power electronics modules considering the target application. In 31st Annual Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2015 - Proceedings (pp. 332-335). [7100183] (Annual IEEE Semiconductor Thermal Measurement and Management Symposium; Vol. 2015-April). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/SEMI-THERM.2015.7100183