Laser via generation into flexible substrates

Zsolt Illyefalvi-Vitéz, Richárd Berényi, Péter Gordon, János Pinkola, Miklós Ruszinkó, Jan Vanfleteren

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

The microelectronics industry is moving toward smaller feature sizes. The main driving forces are to improve performance and to lower cost. From the performance point of view the small distances between chips together with the short interconnection routes have of great importance in order to achieve faster operation. The application of polymeric materials for the insulating and protective layers of interconnect substrates is beneficial to the performance and to the cost of a circuit module as well. An advanced technology for the fabrication of very high density interconnects applies microvia flexible substrates. This technology has particular significance for the interposers of chip scale packages. Laser processing of polymeric materials applied for via generation, image transfer, contour cutting, etc. has proved to be an efficient tool for the fabrication of interconnect substrates. The paper describes some results of a research project that aims at the application of CO2 and frequency multiplied Nd:YAG lasers for drilling via holes into copper clad flexible laminates of polyimide, epoxy and polyester base materials. The effect of the application of an interfacing (adhesive) layer is also the topic of the investigations. The physics of processing using a wavelength range from the far infrared radiation of the CO2 laser till the UV wavelengths of frequency quadrupled Nd:YAG lasers are considered to be modeled, examined and evaluated.

Original languageEnglish
Title of host publicationFirst International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
Subtitle of host publicationIncoperating POLY, PEP and Adhasives in Electronics
Pages230-235
Number of pages6
Publication statusPublished - Dec 1 2001
EventFirst International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incorporating POLY,PEP and Adhesives in Electronics (POLYTRONIC 2001) - Potsdam, Germany
Duration: Oct 21 2001Oct 24 2001

Publication series

NameFirst International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics

Other

OtherFirst International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incorporating POLY,PEP and Adhesives in Electronics (POLYTRONIC 2001)
CountryGermany
CityPotsdam
Period10/21/0110/24/01

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Illyefalvi-Vitéz, Z., Berényi, R., Gordon, P., Pinkola, J., Ruszinkó, M., & Vanfleteren, J. (2001). Laser via generation into flexible substrates. In First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics (pp. 230-235). (First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics).