Laser processing of flexible substrates

Peter Gordon, Richard Berenyi

Research output: Contribution to journalConference article

3 Citations (Scopus)

Abstract

The paper will describe some results of the research project that aimed at the application of CO2 and frequency multiplied Nd:YAG lasers for drilling via holes into copper clad flexible laminates of polyimide and polyester based materials. We have also carried out experiments for removing the insulation layer from the copper foil to open windows, i.e. to get clean copper areas. This can be a key process in the production of TABs. Two wavelengths (10600 nm and 1064) were used to find the optimal process parameters for drilling and layer removing. The samples were examined and evaluated many ways to conclude the general behaviour of the material and its interaction with different laser beams.

Original languageEnglish
Pages (from-to)494-499
Number of pages6
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume4931
Publication statusPublished - Jan 1 2002
Event2002 International Symposium on Microelectronics - Denver, CO, United States
Duration: Sep 4 2002Sep 6 2002

Keywords

  • Blind vias
  • Flexible substrates
  • Laser processing
  • Windows in TABs

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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