Lab sessions and prototyping in interconnection and packaging education

Z. Illyefalvi-Vitez, M. Ruszinko, J. Pinkola, G. Harsányi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

The preparation of electronics engineers for the 21st century's requirements of microelectronics interconnection and packaging is a real challenge for today's education. An approach that teaches interconnection and packaging technology providing lecture courses, lab sessions and independent research studies supported by a prototype manufacturing environment can hopefully achieve the main goals. Supporting projects are essential to develop the prototyping laboratories and to join to the international education network of the field.

Original languageEnglish
Title of host publication23rd IEEE/CPMT International Electronics Manufacturing Technology Symposium, IEMT 1998
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages362-372
Number of pages11
ISBN (Electronic)0780345231
DOIs
Publication statusPublished - Jan 1 1998
Event23rd IEEE/CPMT International Electronics Manufacturing Technology Symposium, IEMT 1998 - Austin, United States
Duration: Oct 21 1998 → …

Other

Other23rd IEEE/CPMT International Electronics Manufacturing Technology Symposium, IEMT 1998
CountryUnited States
CityAustin
Period10/21/98 → …

Fingerprint

Packaging
Education
Microelectronics
Electronic equipment
Engineers

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Cite this

Illyefalvi-Vitez, Z., Ruszinko, M., Pinkola, J., & Harsányi, G. (1998). Lab sessions and prototyping in interconnection and packaging education. In 23rd IEEE/CPMT International Electronics Manufacturing Technology Symposium, IEMT 1998 (pp. 362-372). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IEMT.1998.731159

Lab sessions and prototyping in interconnection and packaging education. / Illyefalvi-Vitez, Z.; Ruszinko, M.; Pinkola, J.; Harsányi, G.

23rd IEEE/CPMT International Electronics Manufacturing Technology Symposium, IEMT 1998. Institute of Electrical and Electronics Engineers Inc., 1998. p. 362-372.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Illyefalvi-Vitez, Z, Ruszinko, M, Pinkola, J & Harsányi, G 1998, Lab sessions and prototyping in interconnection and packaging education. in 23rd IEEE/CPMT International Electronics Manufacturing Technology Symposium, IEMT 1998. Institute of Electrical and Electronics Engineers Inc., pp. 362-372, 23rd IEEE/CPMT International Electronics Manufacturing Technology Symposium, IEMT 1998, Austin, United States, 10/21/98. https://doi.org/10.1109/IEMT.1998.731159
Illyefalvi-Vitez Z, Ruszinko M, Pinkola J, Harsányi G. Lab sessions and prototyping in interconnection and packaging education. In 23rd IEEE/CPMT International Electronics Manufacturing Technology Symposium, IEMT 1998. Institute of Electrical and Electronics Engineers Inc. 1998. p. 362-372 https://doi.org/10.1109/IEMT.1998.731159
Illyefalvi-Vitez, Z. ; Ruszinko, M. ; Pinkola, J. ; Harsányi, G. / Lab sessions and prototyping in interconnection and packaging education. 23rd IEEE/CPMT International Electronics Manufacturing Technology Symposium, IEMT 1998. Institute of Electrical and Electronics Engineers Inc., 1998. pp. 362-372
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