Issues in testing advanced power semiconductor devices

Gabor Farkas, Zoltan Sarkany, M. Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Thermal transient testing is a widely used tool in reliability testing of power semiconductors and structure integrity analysis of packages, cooling mounts etc. The paper demonstrates novel concepts for powering and sensing in thermal tests when wide bandgap compound semiconductor components (GaN, SiC) replace silicon. We highlight problems like the non-linearity of devices in broad temperature ranges; and slow effects (surface charge, carrier absorption on traps) producing false transient signals. We propose methods to overcome these obstacles.

Original languageEnglish
Title of host publicationPCIM Europe 2016; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages596-603
Number of pages8
ISBN (Electronic)9783800741861
Publication statusPublished - Jan 1 2016
Event2016 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2016 - Nuremberg, Germany
Duration: May 10 2016May 12 2016

Other

Other2016 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2016
CountryGermany
CityNuremberg
Period5/10/165/12/16

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Keywords

  • Compound power semiconductor devices
  • GaN
  • HEMT
  • IGBT
  • Si
  • SiC
  • Thermal transient testing

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Control and Optimization
  • Renewable Energy, Sustainability and the Environment
  • Artificial Intelligence
  • Hardware and Architecture
  • Energy Engineering and Power Technology

Cite this

Farkas, G., Sarkany, Z., & Rencz, M. (2016). Issues in testing advanced power semiconductor devices. In PCIM Europe 2016; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (pp. 596-603). [7499411] Institute of Electrical and Electronics Engineers Inc..