Ion implantation process modelling

G. Drozdy, T. Lohner, P. Revesz, K. Tarnay, J. Gyulai

Research output: Contribution to journalArticle

1 Citation (Scopus)


A simulation program for implantation (IMPLAN) has been developed as part of a complete silicon planar technology simulation program (STEP, Silicon Technology Evaluation Program). The input parameters of IMPLAN are the type of implanted ions, the target material, the kind of the eventual covering surface layer and its thickness, the energy of the ion implantation and the dose. The output is the dopant profile in numerical or graphical format. Joined half-Gaussian and Pearson distributions are used in the program in order to get high accuracy. To measure implanted depth profiles we used a high resolution Rutherford backscattering (RBS) technique. Comparison of the experimental results ans simulations shows that the difference between theory and experiment is mostly less than the errors of the measurements.

Original languageEnglish
Pages (from-to)125-128
Number of pages4
Issue number1-2
Publication statusPublished - Jan 1 1983


ASJC Scopus subject areas

  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films

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