Investigation of tin whisker growth: The effects of Ni and Ag underplates

Barbara Horvath, Balázs Illés, Gabor Harsanyi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

A major problem with tin electroplating is the formation of tin whiskers. These are spontaneous protrusions of few microns in diameter and up to hundreds of microns or even millimeters in length. There are several mitigation strategies and using a nickel or silver underplate is proven to be excellent in preventing the forming of CU6SnS intermetallics. Still there are not many scientific researches about the effects ofthis mitigation strategy. Therefore we have tested leadframe samples in different temperature and humidity conditions (105°C/100% relative humidity (RH), 50°C/25% RH) for over 3400 hours. Both leadframes were on bronze substrates and had 1-2 um underplates (silver or nickel) with 5-7 um tin on the top. Our results have shown hillock and whisker growth differences on the samples depending on the nature of the different environmental circumstances, which is originated to the different stress-causing mechanisms, and also growth differences have beenfound on the different underplate materials.

Original languageEnglish
Title of host publicationISSE 2009
Subtitle of host publication32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings
DOIs
Publication statusPublished - Nov 20 2009
EventISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Brno, Czech Republic
Duration: May 13 2009May 17 2009

Publication series

NameISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings

Other

OtherISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics
CountryCzech Republic
CityBrno
Period5/13/095/17/09

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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    Horvath, B., Illés, B., & Harsanyi, G. (2009). Investigation of tin whisker growth: The effects of Ni and Ag underplates. In ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings [5207031] (ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings). https://doi.org/10.1109/ISSE.2009.5207031