Investigation of the pre-heating process during thermosonic wire bonding by FEM simulation

Tamás Garami, G. Takács, Olivér Krammer, András Szabó

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, the pre-heating process of the thermosonic wire bonding process was investigated. In the case of this method, the energy for the bonding process comes from three different sources: ultrasonic vibration, pressure (force) and elevated temperature. The pre-heating system contains a heating table and the sample is positioned on the top of it. In order to determine the exact temperature distribution, a numerical model was prepared, which takes into account the specific geometry of the arrangement and the heat transfer methods between the various surfaces. The heat transfer between the ceramic substrate and the heating plate depends on the surface roughness of the materials, and on the pressure which is exerted by the substrate to the heating table. In our investigation, we implemented a physical test setup with K-type thermocouples which can validate stationary numerical models. The temperature difference between the set temperature of the heating table and the measured temperature was 4-5 °C, while the difference between the set and modeled bond pad's temperatures was only 2-3°C, which information will help to set the temperature of the heating tables more accurate.

Original languageEnglish
Title of host publicationProceedings of the International Spring Seminar on Electronics Technology
PublisherIEEE Computer Society
Pages333-338
Number of pages6
Volume2015-September
ISBN (Print)9781479988600
DOIs
Publication statusPublished - Sep 9 2015
Event38th International Spring Seminar on Electronics Technology, ISSE 2015 - Eger, Hungary
Duration: May 6 2015May 10 2015

Other

Other38th International Spring Seminar on Electronics Technology, ISSE 2015
CountryHungary
CityEger
Period5/6/155/10/15

Fingerprint

Industrial heating
Wire
Finite element method
Heating
Temperature
Numerical models
Heat transfer
Substrates
Thermocouples
Vibrations (mechanical)
Temperature distribution
Ultrasonics
Surface roughness
Geometry

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

Cite this

Garami, T., Takács, G., Krammer, O., & Szabó, A. (2015). Investigation of the pre-heating process during thermosonic wire bonding by FEM simulation. In Proceedings of the International Spring Seminar on Electronics Technology (Vol. 2015-September, pp. 333-338). [7248017] IEEE Computer Society. https://doi.org/10.1109/ISSE.2015.7248017

Investigation of the pre-heating process during thermosonic wire bonding by FEM simulation. / Garami, Tamás; Takács, G.; Krammer, Olivér; Szabó, András.

Proceedings of the International Spring Seminar on Electronics Technology. Vol. 2015-September IEEE Computer Society, 2015. p. 333-338 7248017.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Garami, T, Takács, G, Krammer, O & Szabó, A 2015, Investigation of the pre-heating process during thermosonic wire bonding by FEM simulation. in Proceedings of the International Spring Seminar on Electronics Technology. vol. 2015-September, 7248017, IEEE Computer Society, pp. 333-338, 38th International Spring Seminar on Electronics Technology, ISSE 2015, Eger, Hungary, 5/6/15. https://doi.org/10.1109/ISSE.2015.7248017
Garami T, Takács G, Krammer O, Szabó A. Investigation of the pre-heating process during thermosonic wire bonding by FEM simulation. In Proceedings of the International Spring Seminar on Electronics Technology. Vol. 2015-September. IEEE Computer Society. 2015. p. 333-338. 7248017 https://doi.org/10.1109/ISSE.2015.7248017
Garami, Tamás ; Takács, G. ; Krammer, Olivér ; Szabó, András. / Investigation of the pre-heating process during thermosonic wire bonding by FEM simulation. Proceedings of the International Spring Seminar on Electronics Technology. Vol. 2015-September IEEE Computer Society, 2015. pp. 333-338
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