Investigation of surface mechanical properties of the copper-solder interface by atomic force microscopy

Judit Kámán, Attila Bonyár, Tamás Hurtony, G. Harsányi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this work, the possibility to characterize the mechanical surface properties of solder-joints with AFM techniques was studied. A SAC305 solder joint cross-section was investigated with contact-mode point-spectroscopy to determine the elastic modulus, while tapping-mode imaging was used to calculate the tip-sample dissipation map. A clear advantage of these proposed methods would be the possibility to distinguish the various micro- and nanoscale components of the solder joint structure (intermetallic compounds) and measure their properties individually, which is not possible with other currently widespread methods (e.g. indentation). Our presented preliminary results show, that the mechanical properties of the Cu6Sn5 compound at the solder interface are closer to Cu compared to the much less harder Sn. The difficulties to obtain precise quantitative results with these proposed methods will also be discussed.

Original languageEnglish
Title of host publicationProceedings of the International Spring Seminar on Electronics Technology
PublisherIEEE Computer Society
Pages425-430
Number of pages6
Volume2015-September
ISBN (Print)9781479988600
DOIs
Publication statusPublished - Sep 9 2015
Event38th International Spring Seminar on Electronics Technology, ISSE 2015 - Eger, Hungary
Duration: May 6 2015May 10 2015

Other

Other38th International Spring Seminar on Electronics Technology, ISSE 2015
CountryHungary
CityEger
Period5/6/155/10/15

Fingerprint

Soldering alloys
Atomic force microscopy
Copper
Mechanical properties
Indentation
Intermetallics
Surface properties
Elastic moduli
Spectroscopy
Imaging techniques

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

Cite this

Kámán, J., Bonyár, A., Hurtony, T., & Harsányi, G. (2015). Investigation of surface mechanical properties of the copper-solder interface by atomic force microscopy. In Proceedings of the International Spring Seminar on Electronics Technology (Vol. 2015-September, pp. 425-430). [7248034] IEEE Computer Society. https://doi.org/10.1109/ISSE.2015.7248034

Investigation of surface mechanical properties of the copper-solder interface by atomic force microscopy. / Kámán, Judit; Bonyár, Attila; Hurtony, Tamás; Harsányi, G.

Proceedings of the International Spring Seminar on Electronics Technology. Vol. 2015-September IEEE Computer Society, 2015. p. 425-430 7248034.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kámán, J, Bonyár, A, Hurtony, T & Harsányi, G 2015, Investigation of surface mechanical properties of the copper-solder interface by atomic force microscopy. in Proceedings of the International Spring Seminar on Electronics Technology. vol. 2015-September, 7248034, IEEE Computer Society, pp. 425-430, 38th International Spring Seminar on Electronics Technology, ISSE 2015, Eger, Hungary, 5/6/15. https://doi.org/10.1109/ISSE.2015.7248034
Kámán J, Bonyár A, Hurtony T, Harsányi G. Investigation of surface mechanical properties of the copper-solder interface by atomic force microscopy. In Proceedings of the International Spring Seminar on Electronics Technology. Vol. 2015-September. IEEE Computer Society. 2015. p. 425-430. 7248034 https://doi.org/10.1109/ISSE.2015.7248034
Kámán, Judit ; Bonyár, Attila ; Hurtony, Tamás ; Harsányi, G. / Investigation of surface mechanical properties of the copper-solder interface by atomic force microscopy. Proceedings of the International Spring Seminar on Electronics Technology. Vol. 2015-September IEEE Computer Society, 2015. pp. 425-430
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