Investigation of intermetallic compounds (IMCs) in electrochemically stripped solder joints with SEM

Tamás Hurtony, Attila Bonyár, Péter Gordon, Gábor Harsányi

Research output: Contribution to journalArticle

32 Citations (Scopus)

Abstract

In this work we compare the microstructures of intermetallic compounds (IMCs) in electrochemically stripped solder joints created by two different soldering methods (vapor phase soldering (VPS), and selective laser soldering with a CO 2 laser). After the selective removal of the Sn phase with amperometry, the microstructure and structural composition of the IMC can be revealed in a detailed way, which is unlike any other previously published methods. The differences between the IMC microstructures of the technologically different solder joints were analyzed with optical microscopy and scanning electron microscopy (SEM). Energy dispersive spectroscopy (EDS) measurements were utilized to identify the different intermetallic phases (Ag 3Sn, Cu 6Sn 5). Significant differences were observed in the IMC structures of solder joints prepared by different technologies.

Original languageEnglish
Pages (from-to)1138-1142
Number of pages5
JournalMicroelectronics Reliability
Volume52
Issue number6
DOIs
Publication statusPublished - Jun 1 2012

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Safety, Risk, Reliability and Quality
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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