Investigation of copper corrosion inhibition by STM and EQCM techniques

E. Szöcs, Gy Vastag, A. Shaban, G. Konczos, E. Kálmán

Research output: Contribution to journalArticle

36 Citations (Scopus)

Abstract

The mechanism of copper corrosion and its inhibition were studied using electrochemical techniques, in situ scanning tunneling microscopy (STM) and electrochemical quartz crystal microbalance (EQCM) methods. The morphological changes of Cu (111) were followed in 0.1 M Na2SO4 solution at pH 2.95. The adsorption of 5-mercapto-1-phenyl-tetrazole (5-McPhTT) at different concentrations was studied. The anodic dissolution of copper in 0.1 M Na2SO4 was clearly modified and hindered by the addition of 5-McPhTT. The anodic current density was reduced sharply due to the adsorption of the inhibitor on the metal surface thus providing protection. EQCM data revealed that the addition of the inhibitor to the aggressive solution did not cause a continuous increase in the electrode mass. This fact indicates that the inhibitor effect in hindering copper corrosion was due to the adsorption of a monolayer or even a submonolayer.

Original languageEnglish
Pages (from-to)1339-1345
Number of pages7
JournalJournal of Applied Electrochemistry
Volume29
Issue number11
DOIs
Publication statusPublished - 1999

Fingerprint

Copper corrosion
Quartz crystal microbalances
Scanning tunneling microscopy
Corrosion inhibitors
Adsorption
Copper
Monolayers
Dissolution
Current density
Metals
Electrodes
1H-tetrazole

ASJC Scopus subject areas

  • Electrochemistry

Cite this

Investigation of copper corrosion inhibition by STM and EQCM techniques. / Szöcs, E.; Vastag, Gy; Shaban, A.; Konczos, G.; Kálmán, E.

In: Journal of Applied Electrochemistry, Vol. 29, No. 11, 1999, p. 1339-1345.

Research output: Contribution to journalArticle

@article{bcc9e8d0694448fab665326d2930f09e,
title = "Investigation of copper corrosion inhibition by STM and EQCM techniques",
abstract = "The mechanism of copper corrosion and its inhibition were studied using electrochemical techniques, in situ scanning tunneling microscopy (STM) and electrochemical quartz crystal microbalance (EQCM) methods. The morphological changes of Cu (111) were followed in 0.1 M Na2SO4 solution at pH 2.95. The adsorption of 5-mercapto-1-phenyl-tetrazole (5-McPhTT) at different concentrations was studied. The anodic dissolution of copper in 0.1 M Na2SO4 was clearly modified and hindered by the addition of 5-McPhTT. The anodic current density was reduced sharply due to the adsorption of the inhibitor on the metal surface thus providing protection. EQCM data revealed that the addition of the inhibitor to the aggressive solution did not cause a continuous increase in the electrode mass. This fact indicates that the inhibitor effect in hindering copper corrosion was due to the adsorption of a monolayer or even a submonolayer.",
author = "E. Sz{\"o}cs and Gy Vastag and A. Shaban and G. Konczos and E. K{\'a}lm{\'a}n",
year = "1999",
doi = "10.1023/A:1003869715760",
language = "English",
volume = "29",
pages = "1339--1345",
journal = "Journal of Applied Electrochemistry",
issn = "0021-891X",
publisher = "Springer Netherlands",
number = "11",

}

TY - JOUR

T1 - Investigation of copper corrosion inhibition by STM and EQCM techniques

AU - Szöcs, E.

AU - Vastag, Gy

AU - Shaban, A.

AU - Konczos, G.

AU - Kálmán, E.

PY - 1999

Y1 - 1999

N2 - The mechanism of copper corrosion and its inhibition were studied using electrochemical techniques, in situ scanning tunneling microscopy (STM) and electrochemical quartz crystal microbalance (EQCM) methods. The morphological changes of Cu (111) were followed in 0.1 M Na2SO4 solution at pH 2.95. The adsorption of 5-mercapto-1-phenyl-tetrazole (5-McPhTT) at different concentrations was studied. The anodic dissolution of copper in 0.1 M Na2SO4 was clearly modified and hindered by the addition of 5-McPhTT. The anodic current density was reduced sharply due to the adsorption of the inhibitor on the metal surface thus providing protection. EQCM data revealed that the addition of the inhibitor to the aggressive solution did not cause a continuous increase in the electrode mass. This fact indicates that the inhibitor effect in hindering copper corrosion was due to the adsorption of a monolayer or even a submonolayer.

AB - The mechanism of copper corrosion and its inhibition were studied using electrochemical techniques, in situ scanning tunneling microscopy (STM) and electrochemical quartz crystal microbalance (EQCM) methods. The morphological changes of Cu (111) were followed in 0.1 M Na2SO4 solution at pH 2.95. The adsorption of 5-mercapto-1-phenyl-tetrazole (5-McPhTT) at different concentrations was studied. The anodic dissolution of copper in 0.1 M Na2SO4 was clearly modified and hindered by the addition of 5-McPhTT. The anodic current density was reduced sharply due to the adsorption of the inhibitor on the metal surface thus providing protection. EQCM data revealed that the addition of the inhibitor to the aggressive solution did not cause a continuous increase in the electrode mass. This fact indicates that the inhibitor effect in hindering copper corrosion was due to the adsorption of a monolayer or even a submonolayer.

UR - http://www.scopus.com/inward/record.url?scp=0032596081&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0032596081&partnerID=8YFLogxK

U2 - 10.1023/A:1003869715760

DO - 10.1023/A:1003869715760

M3 - Article

AN - SCOPUS:0032596081

VL - 29

SP - 1339

EP - 1345

JO - Journal of Applied Electrochemistry

JF - Journal of Applied Electrochemistry

SN - 0021-891X

IS - 11

ER -