Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing

Oliver Krammer, Benjámin Gyarmati, A. Szilágyi, Richárd Storcz, László Jakab, Balázs Illés, Attila Géczy, Karel Dušek

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

Purpose - A measurement method has been developed to reveal the viscosity change of solder pastes during stencil printing. This paper aimed to investigate thixotropic behaviour, the viscosity change of a lead-free solder paste (Type 4). Design/methodology/approach - The viscosity change of the solder paste during stencil printing cycles was characterised in such a way that the time-gap between the printing cycles was modelled with a rest period between every rheological measurement. This period was set as 15, 30 and 60 s during the research. The Cross model was fitted to the measurement results, and the η0 parameter was used to characterise the viscosity change. The number of printing cycles necessary for reaching a stationary state in viscosity was determined for various rest periods. Findings - It was found that the decrease in zero-shear viscosity is significant (25 per cent) in the first cycles, and it starts to become stationary at the sixth-seventh cycles. This means a printing process can provide the appropriate deposits only after the 7th cycle with the investigated Type 4 solder paste. Originality/value - Time-dependent rheological behaviour of solder pastes was studied in the literature, but only the viscosity change over continuous time at constant shear rates was examined. The time-gap between stencil printing cycles was not considered, and thixotropic behaviour of solder pastes was also neglected. Therefore, the authors developed a measurement set which is able to model the effect of time-gap between printing cycles on the viscosity change of solder pastes.

Original languageEnglish
Pages (from-to)10-14
Number of pages5
JournalSoldering and Surface Mount Technology
Volume29
Issue number1
DOIs
Publication statusPublished - 2017

Fingerprint

solders
Ointments
printing
Soldering alloys
Printing
Viscosity
viscosity
cycles
shear
Shear viscosity
Shear deformation
Deposits
deposits
methodology

Keywords

  • Rheology
  • Solder paste
  • Stencil printing
  • Thixotropic behaviour
  • Viscosity

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing. / Krammer, Oliver; Gyarmati, Benjámin; Szilágyi, A.; Storcz, Richárd; Jakab, László; Illés, Balázs; Géczy, Attila; Dušek, Karel.

In: Soldering and Surface Mount Technology, Vol. 29, No. 1, 2017, p. 10-14.

Research output: Contribution to journalArticle

Krammer, Oliver ; Gyarmati, Benjámin ; Szilágyi, A. ; Storcz, Richárd ; Jakab, László ; Illés, Balázs ; Géczy, Attila ; Dušek, Karel. / Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing. In: Soldering and Surface Mount Technology. 2017 ; Vol. 29, No. 1. pp. 10-14.
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