Investigating of electrochemical migration on low-ag lead-free solder alloys

Balint Medgyes, Daniel Rigler, Balazs Illes, Gabor Harsanyi, Laszlo Gal

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

Among the conditions of high humidity, elevated temperature, and voltage applied, metals and alloys in electronic components and assemblies can cause insulation failures by forming so called dendrites due to the electrochemical migration (ECM) failure phenomenon. This effect causes short-circuit failures of the electronic circuits, which might lead to catastrophic failure. The ECM behavior of lead-free micro-alloyed low Ag content solder alloys (SAC0307 and SAC0807) were compared with common used SAC305, SAC405 and with the traditionally lead-bearing solder alloys: Sn63Pb37 and Sn62Pb36Ag2 as references. In order to carry out the ECM investigations, water drop (WD) tests were made on standard comb patterns in 1 mMol NaCl and 1 mMol Na 2SO4 solutions as well. The results have shown that the SAC0807 low Ag content micro-alloyed solder alloy could have a relative weak resistance against ECM.

Original languageEnglish
Title of host publication2012 IEEE 18th International Symposium for Design and Technology of Electronics Packages, SIITME 2012 - Conference Proceedings
Pages147-150
Number of pages4
DOIs
Publication statusPublished - Dec 1 2012
Event2012 IEEE 18th International Symposium for Design and Technology of Electronics Packages, SIITME 2012 - Alba Iulia, Romania
Duration: Oct 25 2012Oct 28 2012

Publication series

Name2012 IEEE 18th International Symposium for Design and Technology of Electronics Packages, SIITME 2012 - Conference Proceedings

Conference

Conference2012 IEEE 18th International Symposium for Design and Technology of Electronics Packages, SIITME 2012
CountryRomania
CityAlba Iulia
Period10/25/1210/28/12

    Fingerprint

Keywords

  • electrochemical migration
  • lead-free low Ag micro-alloyed solder alloy
  • water drop test

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Medgyes, B., Rigler, D., Illes, B., Harsanyi, G., & Gal, L. (2012). Investigating of electrochemical migration on low-ag lead-free solder alloys. In 2012 IEEE 18th International Symposium for Design and Technology of Electronics Packages, SIITME 2012 - Conference Proceedings (pp. 147-150). [6384415] (2012 IEEE 18th International Symposium for Design and Technology of Electronics Packages, SIITME 2012 - Conference Proceedings). https://doi.org/10.1109/SIITME.2012.6384415