Intermixing in Cu/Co: Molecular dynamics simulations and Auger electron spectroscopy depth profiling

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3 Citations (Scopus)

Abstract

The ion-bombardment induced evolution of intermixing is studied by molecular dynamics simulations and by Auger electron spectroscopy depth profiling analysis (AESD) in Cu/Co multilayer. It has been shown that from AESD we can derive the low-energy mixing rate and which can be compared with the simulated values obtained by molecular dynamics (MD) simulations. The overall agreement is reasonably good hence MD can hopefully be used to estimate the rate of intermixing in various interface systems.

Original languageEnglish
Pages (from-to)19-26
Number of pages8
JournalDefect and Diffusion Forum
Volume264
DOIs
Publication statusPublished - Jan 1 2007

Keywords

  • Atomistic computer simulations
  • Auger electron spectroscopy
  • Cu/Co
  • Depth profiling
  • Ion-solid interaction
  • Ion-sputtering
  • Molecular dynamics
  • Multilayer
  • Sputter removal
  • Thin film

ASJC Scopus subject areas

  • Radiation
  • Materials Science(all)
  • Condensed Matter Physics

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