A Co-Cu multilayer system was depth profiled by 1 keV Ar+ ions varying the angle of incidence in the range of 78°-86°. The specimen was rotated during ion sputtering. Using these sputtering conditions, it was observed that the relative sputter rate of Cu to Co depend on the angle of incidence, the broadening of the Co/Cu interface is much stronger than that of the Cu/Co interface and, the interface broadening of the Co/Cu interface increases with the increase of the relative sputter rate.
|Number of pages||5|
|Journal||Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films|
|Publication status||Published - May 1 2003|
ASJC Scopus subject areas
- Condensed Matter Physics
- Surfaces and Interfaces
- Surfaces, Coatings and Films