Integration of a network solver and a field solver for the mixed level thermal simulation of MEMS problems

Research output: Chapter in Book/Report/Conference proceedingChapter

9 Citations (Scopus)

Abstract

The paper presents an algorithm for the thermal simulation of MEMS problems for the cases when certain parts of the MEMS structure are given with their detailed structural description while others are given with the RC network compact models. The presented co-simulation algorithm enables fast simulation in the frequency or in the time domain, and can be a very useful extension of any kind of field solvers. The thermal simulation of a hot-plate problem demonstrates the advantages and the simplicity of the method.

Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
EditorsB. Courtois, J.M. Karam, K.W. Markus, B. Michel, T. Mukherjee
Pages36-43
Number of pages8
Volume4755
DOIs
Publication statusPublished - 2002
EventDesign, Test, Integration, and packaging of MEMS/MOEMS 2002 - Cannes, France
Duration: May 6 2002May 8 2002

Other

OtherDesign, Test, Integration, and packaging of MEMS/MOEMS 2002
CountryFrance
CityCannes
Period5/6/025/8/02

Fingerprint

thermal simulation
microelectromechanical systems
MEMS
RC circuits
simulation
Hot Temperature

Keywords

  • Compact models
  • Field solvers
  • Multiport models
  • Reduced order models
  • Thermal models
  • Thermal simulation

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

Cite this

Rencz, M., Székely, V., & Poppe, A. (2002). Integration of a network solver and a field solver for the mixed level thermal simulation of MEMS problems. In B. Courtois, J. M. Karam, K. W. Markus, B. Michel, & T. Mukherjee (Eds.), Proceedings of SPIE - The International Society for Optical Engineering (Vol. 4755, pp. 36-43) https://doi.org/10.1117/12.462840

Integration of a network solver and a field solver for the mixed level thermal simulation of MEMS problems. / Rencz, M.; Székely, V.; Poppe, A.

Proceedings of SPIE - The International Society for Optical Engineering. ed. / B. Courtois; J.M. Karam; K.W. Markus; B. Michel; T. Mukherjee. Vol. 4755 2002. p. 36-43.

Research output: Chapter in Book/Report/Conference proceedingChapter

Rencz, M, Székely, V & Poppe, A 2002, Integration of a network solver and a field solver for the mixed level thermal simulation of MEMS problems. in B Courtois, JM Karam, KW Markus, B Michel & T Mukherjee (eds), Proceedings of SPIE - The International Society for Optical Engineering. vol. 4755, pp. 36-43, Design, Test, Integration, and packaging of MEMS/MOEMS 2002, Cannes, France, 5/6/02. https://doi.org/10.1117/12.462840
Rencz M, Székely V, Poppe A. Integration of a network solver and a field solver for the mixed level thermal simulation of MEMS problems. In Courtois B, Karam JM, Markus KW, Michel B, Mukherjee T, editors, Proceedings of SPIE - The International Society for Optical Engineering. Vol. 4755. 2002. p. 36-43 https://doi.org/10.1117/12.462840
Rencz, M. ; Székely, V. ; Poppe, A. / Integration of a network solver and a field solver for the mixed level thermal simulation of MEMS problems. Proceedings of SPIE - The International Society for Optical Engineering. editor / B. Courtois ; J.M. Karam ; K.W. Markus ; B. Michel ; T. Mukherjee. Vol. 4755 2002. pp. 36-43
@inbook{bab744fc88ea4245853b28245247e0e9,
title = "Integration of a network solver and a field solver for the mixed level thermal simulation of MEMS problems",
abstract = "The paper presents an algorithm for the thermal simulation of MEMS problems for the cases when certain parts of the MEMS structure are given with their detailed structural description while others are given with the RC network compact models. The presented co-simulation algorithm enables fast simulation in the frequency or in the time domain, and can be a very useful extension of any kind of field solvers. The thermal simulation of a hot-plate problem demonstrates the advantages and the simplicity of the method.",
keywords = "Compact models, Field solvers, Multiport models, Reduced order models, Thermal models, Thermal simulation",
author = "M. Rencz and V. Sz{\'e}kely and A. Poppe",
year = "2002",
doi = "10.1117/12.462840",
language = "English",
volume = "4755",
pages = "36--43",
editor = "B. Courtois and J.M. Karam and K.W. Markus and B. Michel and T. Mukherjee",
booktitle = "Proceedings of SPIE - The International Society for Optical Engineering",

}

TY - CHAP

T1 - Integration of a network solver and a field solver for the mixed level thermal simulation of MEMS problems

AU - Rencz, M.

AU - Székely, V.

AU - Poppe, A.

PY - 2002

Y1 - 2002

N2 - The paper presents an algorithm for the thermal simulation of MEMS problems for the cases when certain parts of the MEMS structure are given with their detailed structural description while others are given with the RC network compact models. The presented co-simulation algorithm enables fast simulation in the frequency or in the time domain, and can be a very useful extension of any kind of field solvers. The thermal simulation of a hot-plate problem demonstrates the advantages and the simplicity of the method.

AB - The paper presents an algorithm for the thermal simulation of MEMS problems for the cases when certain parts of the MEMS structure are given with their detailed structural description while others are given with the RC network compact models. The presented co-simulation algorithm enables fast simulation in the frequency or in the time domain, and can be a very useful extension of any kind of field solvers. The thermal simulation of a hot-plate problem demonstrates the advantages and the simplicity of the method.

KW - Compact models

KW - Field solvers

KW - Multiport models

KW - Reduced order models

KW - Thermal models

KW - Thermal simulation

UR - http://www.scopus.com/inward/record.url?scp=1242306430&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=1242306430&partnerID=8YFLogxK

U2 - 10.1117/12.462840

DO - 10.1117/12.462840

M3 - Chapter

AN - SCOPUS:1242306430

VL - 4755

SP - 36

EP - 43

BT - Proceedings of SPIE - The International Society for Optical Engineering

A2 - Courtois, B.

A2 - Karam, J.M.

A2 - Markus, K.W.

A2 - Michel, B.

A2 - Mukherjee, T.

ER -