### Abstract

The paper presents an algorithm for the thermal simulation of MEMS problems for the cases when certain parts of the MEMS structure are given with their detailed structural description while others are given with the RC network compact models. The presented co-simulation algorithm enables fast simulation in the frequency or in the time domain, and can be a very useful extension of any kind of field solvers. The thermal simulation of a hot-plate problem demonstrates the advantages and the simplicity of the method.

Original language | English |
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Title of host publication | Proceedings of SPIE - The International Society for Optical Engineering |

Editors | B. Courtois, J.M. Karam, K.W. Markus, B. Michel, T. Mukherjee |

Pages | 36-43 |

Number of pages | 8 |

Volume | 4755 |

DOIs | |

Publication status | Published - 2002 |

Event | Design, Test, Integration, and packaging of MEMS/MOEMS 2002 - Cannes, France Duration: May 6 2002 → May 8 2002 |

### Other

Other | Design, Test, Integration, and packaging of MEMS/MOEMS 2002 |
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Country | France |

City | Cannes |

Period | 5/6/02 → 5/8/02 |

### Fingerprint

### Keywords

- Compact models
- Field solvers
- Multiport models
- Reduced order models
- Thermal models
- Thermal simulation

### ASJC Scopus subject areas

- Electrical and Electronic Engineering
- Condensed Matter Physics

### Cite this

*Proceedings of SPIE - The International Society for Optical Engineering*(Vol. 4755, pp. 36-43) https://doi.org/10.1117/12.462840

**Integration of a network solver and a field solver for the mixed level thermal simulation of MEMS problems.** / Rencz, M.; Székely, V.; Poppe, A.

Research output: Chapter in Book/Report/Conference proceeding › Chapter

*Proceedings of SPIE - The International Society for Optical Engineering.*vol. 4755, pp. 36-43, Design, Test, Integration, and packaging of MEMS/MOEMS 2002, Cannes, France, 5/6/02. https://doi.org/10.1117/12.462840

}

TY - CHAP

T1 - Integration of a network solver and a field solver for the mixed level thermal simulation of MEMS problems

AU - Rencz, M.

AU - Székely, V.

AU - Poppe, A.

PY - 2002

Y1 - 2002

N2 - The paper presents an algorithm for the thermal simulation of MEMS problems for the cases when certain parts of the MEMS structure are given with their detailed structural description while others are given with the RC network compact models. The presented co-simulation algorithm enables fast simulation in the frequency or in the time domain, and can be a very useful extension of any kind of field solvers. The thermal simulation of a hot-plate problem demonstrates the advantages and the simplicity of the method.

AB - The paper presents an algorithm for the thermal simulation of MEMS problems for the cases when certain parts of the MEMS structure are given with their detailed structural description while others are given with the RC network compact models. The presented co-simulation algorithm enables fast simulation in the frequency or in the time domain, and can be a very useful extension of any kind of field solvers. The thermal simulation of a hot-plate problem demonstrates the advantages and the simplicity of the method.

KW - Compact models

KW - Field solvers

KW - Multiport models

KW - Reduced order models

KW - Thermal models

KW - Thermal simulation

UR - http://www.scopus.com/inward/record.url?scp=1242306430&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=1242306430&partnerID=8YFLogxK

U2 - 10.1117/12.462840

DO - 10.1117/12.462840

M3 - Chapter

AN - SCOPUS:1242306430

VL - 4755

SP - 36

EP - 43

BT - Proceedings of SPIE - The International Society for Optical Engineering

A2 - Courtois, B.

A2 - Karam, J.M.

A2 - Markus, K.W.

A2 - Michel, B.

A2 - Mukherjee, T.

ER -