Integration of a network solver and a field solver for the mixed level thermal simulation of MEMS problems

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9 Citations (Scopus)


The paper presents an algorithm for the thermal simulation of MEMS problems for the cases when certain parts of the MEMS structure are given with their detailed structural description while others are given with the RC network compact models. The presented co-simulation algorithm enables fast simulation in the frequency or in the time domain, and can be a very useful extension of any kind of field solvers. The thermal simulation of a hot-plate problem demonstrates the advantages and the simplicity of the method.

Original languageEnglish
Pages (from-to)36-43
Number of pages8
JournalProceedings of SPIE - The International Society for Optical Engineering
Publication statusPublished - Jan 1 2002



  • Compact models
  • Field solvers
  • Multiport models
  • Reduced order models
  • Thermal models
  • Thermal simulation

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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